Olin Corporation

Swiss Aluminium Ltd.

International Telephone and Telegraph Corporation

Alumax, Inc.

Gbc Metals, LLC

Other

Wieland-werke Ag

Weiland-werke Ag

Global Metals, LLC

Derek E Tyler

John C Yarwood

Gary L Ungarean

Jonathan A Dantzig

Harvey P Cheskis

Peter J Kindlmann

Michael J Pryor

Gerhart K Gaule

Joseph Winter

Ik Y Yun

Paul D Tungatt

Frank N Mandigo

Peter W Robinson

Hans-Achim Kuhn

Deepak Mahulikar

John F Breedis

Sankaranarayanan Ashok

Szuchain F Chen

W Gary Watson

Jeffrey S Braden

Andreas Boegel

Frank Michael Keppeler

Joerg Seeger

Louis P Stone

Eugene Shapiro

Julius C Fister

Ronald N Caron

Kenneth P Young

Brian Mravic

Paul R Hoffman

James E Dore

Stanley Shapiro

Anthony M Pasqualoni

Prakash D Parikh

Dennis R Brauer

Abid A Khan

Nina Yukov

David W Dickinson

Uwe Hofmann

Richard P Vierod

Richard C Milici

Arvind Parthasarathi

James M Popplewell

William L Brenneman

William G Watson

Christopher P Laurello

J&ouml;rg Seeger

Andreas B&ouml;gel

George A List

William R Brenneman

John Shabarack

Gerhard K Gaule

Patrick D Renschen

Christoper P Laurello

William L Brennemann

Peter William Robinson

Andreas (deceased) Boegel

Jorg Seeger

Andreas Bogel

Ralph A Mutschler

Hans Achim Kuhn

Andrea Kaufler

Andrew J Vacco

James A Brock

Chen Szuchain

A copper alloy having an improved combination of yield strength and electrical conductivity contains, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up to 1% of silver.

Copper alloy containing cobalt, nickel and silicon

A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up 1% of silver. A process to manufacture the alloys of the invention as well as other copper-nickel-silicon alloys includes the sequential steps of (a). casting the copper alloy; (b). hot working the cast copper-base alloy to effect a first reduction in cross-sectional area; (c). solutionizing the cast copper-base alloy at a temperature and for a time effective to substantially form a single phase alloy; (d). first age annealing the alloy at a temperature and for a time effective to precipitate an amount of a second phase effective to form a multi-phase alloy having silicides; (e). cold working the multi-phase alloy to effect a second reduction in cross-sectional area; and (f). second age annealing the multiphase alloy at a temperature and for a time effective to precipitate additional silicides thereby raising conductivity, wherein the second age annealing temperature is less than the first age annealing temperature.

A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, from 0.5% to 1.5% of silicon, and the balance is copper and inevitable impurities. Further, the total nickel plus cobalt content is from 1.7% to 4.3%, the ratio of nickel to cobalt is from 1.01:1 to 2.6:1, the amount of (Ni+Co)/Si is between 3.5 and 6, the electrical conductivity is in excess of 40% IACS and the yield strength is in excess of 95 ksi. An optional inclusion is up 1% of silver. A process to manufacture the alloy includes the sequential steps of (a). casting; (b). hot working; (c). solutionizing; (d). first age annealing; (e). cold working; and (f). second age annealing wherein the second age annealing temperature is less than the first age annealing temperature.

The present invention is directed to a coated substrate, comprising: an antitarnish layer deposited on a substrate in an amount effective to prevent tarnishing of said coated substrate; and an outer layer deposited onto said antitarnish layer, said outer layer comprising tin or tin alloys having at least 50% by weight tin. The present invention is also directed to coated substrates having a concentration gradient of antitarnish agent diffused into the coating, as well as methods of forming such coated substrates.

Tarnish deterring tin coating

A copper alloy that consists essentially of, by weight, from 0.15% to 0.7% of chromium, from 0.005% to 0.3% of silver, from 0.01% to 0.15% of titanium, from 0.01% to 0.10% of silicon, up to 0.2% of iron, up to 0.5% of tin, and the balance copper and inevitable impurities has high strength, a yield strength in excess of 80 ksi, and high electrical conductivity, in excess of 80% IACS. The alloy further has substantially isotropic bend characteristics when the processing route includes a solution heat anneal above 850&deg; C. and subsequent cold rolling into sheet, strip or foil interspersed by bell annealing. As a result, the alloy is particularly suited for forming into box-type electrical connectors for both automotive or multimedia applications. The alloy is also suitable for forming into a rod, wire or section.

Silver containing copper alloy

A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a release force for the metal foil layer from the carrier strip that is typically on the order of 0.1 pound per inch to 2 pounds per inch. This provides sufficient adhesion to prevent premature separation of the metal foil layer from the carrier layer, but easy removal of the carrier layer when desired. The metal foil layer may be electrolytically formed copper having a low height profile, on the order of 0.5 micron to 2.7 microns, bond strength enhancing agent coating a side of the metal foil layer. The enhanced surface is subsequently bonded to a dielectric and the carrier layer then removed.

Copper foil with low profile bond enahncement

An electrical conductor has a copper base substrate coated with a tin base coating layer. To inhibit the formation of a copper/tin intermetallic and the resultant depletion of the free, unreacted, tin utilized as an oxidation and corrosion barrier, a barrier is interposed between the substrate and the coating. In a first embodiment, the barrier is formed from multiple constituent layers, at least one of which is copper. The thickness ('y') of the copper layer is dependent on the anticipated service temperature and satisfies the equation y=(-1.52+0.0871x+0.00859 t).+-.50% where t=anticipated time at the service temperature, x=anticipated service temperature (Celsius), and y=the thickness of the copper layer in microinches. In a second embodiment, the barrier layer is formed from one or more constituent layers, at least one of which is iron or iron base.

Multi-layer diffusion barrier for a tin coated electrical connector

There is provided a lead-free projectile, such as a bullet or a ballistic shot, formed by liquid phase sintering or liquid phase bonding of a first particulate having a density greater than lead, a second, ductile, particulate having a melting temperature in excess of 400.degree. C. and a binder having a fluidity temperature that is less than the melting temperature of the second particulate. Unlike solid phase sintering that tends to produce articles having a porosity of about 20%, by volume, liquid phase sintering and liquid phase bonding achieve close to 0% porosity. Reducing the porosity level decreases the amount of high density, first particulate, required to achieve a density close to that of lead. Since the high density particulate tends to be the most expensive component of the projectile, this significantly reduces the cost of the projectile. The reduced porosity also allows for an increase in the amount of the second, ductile, component. Increased ductility generates a projectile with a reduced likelihood of fragmentation on being fired from a weapon and with better deformation on impact with a target. One suitable composition for the projectile is ferrotungten-iron-zinc.

Lead-free shot formed by liquid phase bonding

There is provided a phosphor bronze alloy having a grain structure that is refined by the addition of a controlled amount of iron. Direct chill cast alloys containing from 1.5% to 2.5%, by weight tin, from 1.65% to 2.65% iron, from 0.03% to 0.35% phosphorous and the remainder copper and inevitable impurities have an as-cast average crystalline grain size of less than 100 microns and are readily hot worked. When the iron content is too low, the average crystalline grain size increases and the alloy cracks during hot working. When the iron content is too high, iron stringers form, detrimentally impacting both the appearance and properties of a wrought strip.

Iron modified phosphor-bronze

There is provided a molded plastic electronic package having improved thermal dissipation. A thermal dissipator, such as a heat spreader or a heat slug is partially encapsulated in the molding resin. The thermal dissipator has a density less than that of copper and a coefficient of thermal conductivity that is constant or increases as the package periphery is approached.

Molded plastic semiconductor package including heat spreader

There is provided a metallic composite useful for coinage. The core is formed from a copper alloy that contains between 50% and 99.0% copper, has a room temperature electrical conductivity in excess of 25% IACS an initial yield strength in excess of 10,000 psi and a dynamic softening response onset at a temperature in the range of 200.degree. C.-400.degree. C. The cladding layers have an initial yield strength more than that of the core and a gold color. The strengthening response of the core during cladding is similar to that of the cladding layers making the metallic composites resistant to corrugation. Reducing corrugation increases the sensitivity of electromagnetic coin discriminators.

Copper alloy clad for coinage

There is provided an electronic package where the package components define a cavity. A semiconductor device and a portion of a leadframe occupy part of the cavity. Substantially the remainder of the cavity is filled with a compliant polymer, such as a silicone gel. Since the cavity is no longer susceptible to gross leak failure, the seal width of adhesives used to assemble the package may be reduced, thereby increasing the area available for mounting the semiconductor device.

Metal electronic package with reduced seal width

There is provided an apparatus and method for the manufacture of metallic articles. A molten metal stream is disrupted, such as by gas atomization, to form a plurality of molten metal droplets. The molten metal droplets pass through a cooling zone having a length sufficient to allow up to about 30 volume percent of each of the droplets to solidify. A mold then receives and completes solidification of the metal droplets. When under about 30 volume percent of the droplets is solid, the droplets retain liquid characteristics and readily flow within the mold.

Vertical casting process

A metal liner for a shaped charge device having a ductile metal matrix and a discrete second phase is provided. The allow composition is selected so the second phase is molten when the liner is accelerated following detonation. The molten phase reduces the tensile strength of the matrix so that the liner slug is pulverized on striking a well casing. The slug does not penetrate the hole perforated in the well casing by the liner jet and oil flow into the well bore is not impeded. The liner is formed by directly casting the desired alloy to the desired shape.

Copper alloys for shaped charge liners

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Cheshire, CT, United States of America

Derek E Tyler