Infineon Technologies Ag

Derek Debie

Klaus Elian

Ludwig Heitzer

Cyrus Ghahremani

Jens G Pohl

Andreas Allmeier

Thorsten Meyer

Christian Geissler

David Tumpold

Matthias Eberl

Johann Strasser

Johannes Lodermeyer

Alexander Zoepfl

Oskar Neuhoff

Fabian Merbeler

Fabian Streb

Thomas Müller

Christian Irrgang

The application relates to a semiconductor device for particle measurement having a cavity housing and a MEMS chip arranged inside the cavity housing. The housing includes a first opening, via which the cavity is connected to the surroundings and in which a first grating is arranged, which is capable by setting it to a first electrical potential of attracting particles from the surroundings and/or electrically charging them. The MEMS chip includes a membrane facing toward the first opening, which is capable by setting it to a second electrical potential of attracting particles. The application furthermore relates to a method for operating a semiconductor device having a cavity housing and a MEMS chip arranged inside the cavity housing.

Semiconductor device for particle measurement and method for operating the semiconductor device

A radiation source device includes at least one membrane layer, a radiation source structure to emit electromagnetic or infrared radiation, a substrate and a spacer structure, wherein the substrate and the at least one membrane form a chamber, wherein a pressure in the chamber is lower than or equal to a pressure outside of the chamber, and wherein the radiation source structure is arranged between the at least one membrane layer and the substrate.

Radiation source device

An ultrasonic touch sensor includes a housing having a package cavity; an ultrasonic transmitter arranged within the package cavity, and configured to transmit an ultrasonic transmit wave; an ultrasonic receiver arranged within the package cavity, and configured to receive an ultrasonic reflected wave produced by a reflection of the ultrasonic transmit wave and generate a measurement signal representative of the ultrasonic reflected wave; a measurement circuit arranged within the package cavity and coupled to the ultrasonic receiver, and configured to detect a touch or a non-touch based on the measurement signal; a light source configured to produce an activating light; and a coupling medium that fills or at least partially fills the package cavity. The coupling medium includes a luminescent material that is configured to be activated by the activating light to produce a backlight that is emitted from the package cavity.

Ultrasonic touch sensor with backlight

A method for producing a nanofilm includes providing a microsieve having a first and a second opposite surface region, wherein micropores are formed between the first and second surface regions; applying a nanomaterial suspension on the first surface region of the microsieve, wherein the nanomaterial suspension comprises nanomaterial particles; and creating a pressure difference at a plurality of the micropores between the first and second surface region of the microsieve in order to move the nanomaterial suspension into the micropores and/or through the micropores, such that the nanomaterial particles adhere to the first surface region and to the wall regions of the micropores and form the nanofilm.

Method for producing a nanofilm, sensor arrangement comprising a nanofilm, and nanosieve comprising a nanofilm

A microelectromechanical systems (MEMS) package assembly and a method of manufacturing the same is provided. The MEMS package assembly includes a substrate, a housing coupled to the substrate to form a cavity, wherein the housing includes a transparent plate disposed above and parallel to the substrate and is configured to permit a transmission of light therethrough, and a MEMS chip disposed within the cavity and including a first main surface proximal to the transparent plate and a second main surface opposite to the first main surface and coupled to the substrate. The MEMS chip is oriented such that the first main surface is tilted at a tilt angle with respect to the transparent plate.

Tilted chip assembly for optical devices

Growing community of inventors

Bogen, Germany

Derek Debie