Apple Inc.

Derek C Krass

Benjamin Shane Bustle

Scott A Myers

Michael Benjamin Wittenberg

Matthew D Hill

Lucy Elizabeth Browning

Ashutosh Yugesh Shukla

James B Smith

Rico L Zorkendorfer

Julian Hoenig

Tyler B Cater

Osamu Yabe

Christopher J Stringer

Scott W Slabaugh

Wayne Cowan

Michael Brickner

Ian Davison

Jonathan P Ive

Duncan Robert Kerr

Bartley K Andre

Richard P Howarth

Eugene Antony Whang

Peter N Russell-Clarke

Martha Evans Hankey

Jody R Akana

Jeremy D Bataillou

Shota Aoyagi

Benjamin Andrew Shaffer

Anthony Michael Ashcroft

Mikael M Silvanto

Molly J Anderson

Markus Peter Diebel

Clement Tissandier

Julian Jaede

Marine C Bataille

Sung-Ho Tan

Paul Choiniere

Jason P Shannon

Thomas Johannessen

Jason B Neevel

Jason M Gillier

Sowmya Laxminarayanan

Aidan R Gallagher

Richard Hung Minh Dinh

Daniel William Jarvis

Douglas Joseph Weber

Albert John Golko

Christopher R Wilk

David E Kingman

Nicholas George Merz

Onur I Ilkorur

Rasamy Phouthavong

Peter F Masschelein

Kevin M Froese

Arturo Llamazares Domper

Matthew P Rao

James R Krogdahl

Jen-Chun Hsu

Stefan C Mag

Vincent Yan

Michael Ngo

Andrew J Meschke

Qian Zhang

Thomas H Tsang

Logan A Rotolo

Joseph I Briskey

Yogesh Upreti

Olivier C Barthomeuf

Martin Gross

Paul M Connolly

An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

Housing features of an electronic device

A system may have structure. The structures may include laminated structures formed by attaching inner and outer layers together with a layer of adhesive. The inner and outer layers in a structure may be formed from polymer such as polycarbonate. Forming the structure layers from polymer may allow the structure to have desired curvature. To improve safety and/or acoustic performance of the structure, the inner and outer structure layers may be formed from different materials. The outer polymer layer may be formed from polycarbonate and the inner polymer layer may be formed from a more brittle polymer such as polymethyl methacrylate (PMMA).

Laminated polymer windows

Attachment systems for attaching a wearable electronic device to a user including a sizing band and a retaining band are disclosed. The sizing band includes at least one sizing eyelet and a band-insertable end. The retaining band includes at least a post for insertion into the sizing eyelet of the sizing band and a concealment aperture configured to receive the band-insertable end of the sizing band. On a bottom surface of the retaining band can be a recessed guide bed configured to guide the band-insertable end along the bottom surface of the retaining band. A wearable electronic device can couple to both the sizing band and the retaining band by accepting an end portion of each band into receiving channels extending into opposite sidewalls of the housing.

Attachment systems for electronic devices

Housing module for an electronic device

Systems and methods of providing a composite material that is bendable but substantially resists stretching under tension. One embodiment may take the form of a composite material formed by over-molding a woven glass fiber with silicone. The woven glass fiber may be rolled out with a silicon polymer melted into the woven fabric as the rolling process continues. The composite of the two materials may provide a material that bends easily but does not substantially stretch.

Flexibility-controlled composite material and method of manufacture

A composite material is disclosed which includes a plastic layer formed on a layer of metal. The metal layer includes pores into which an adhesive is introduced. The plastic layer is injection molded onto the metal layer so as to contact the adhesive in the pores. The plastic layer is thus bonded to the metal layer.

Electronic device structure formed from porous metal bonded to plastic

Dielectric such as polyether ether ketone may be used in forming radio-frequency flexible printed circuits. Filler may be incorporated into the dielectric to adjust the coefficient of thermal expansion of the flexible printed circuit. One or more layers of the flexible printed circuit may be unfilled and one or more layers of the flexible printed circuit may be filled. Antennas may be formed from metal traces on the flexible printed circuit, metal electronic device housing structures, or other conductive structures. A transmission line on the flexible printed circuit may couple radio-frequency transceiver circuitry in an electronic device to an antenna. A flexible printed circuit may have a portion with enhanced bendability in a location that overlaps a bend region. The enhanced bendability region may have less filler than other portions of the flexible printed circuit.

Devices with radio-frequency printed circuits

Compound structures and methods for forming the same are described. The compound structures can be used to form an enclosure. The enclosure may be formed from metal, such as aluminum, and further include one or more non-metal regions that allow for transmission and receipt of electromagnetic waves, such as radio frequency waves. The non-metal region can include a first section, a second section, and an optional cosmetic section. The first section can be firmly molded onto a metal section of the enclosure by small pores formed within the metal section. The second section can engage with interlock features of the first section. The optional cosmetic section can cover the first section and the second section such that the first section and the second section are not visible from an exterior of the enclosure.

Apparatus and method of forming a compound structure

A micro speaker assembly including a speaker enclosure having an enclosure wall separating a surrounding environment from an encased space, wherein the enclosure wall defines, in part, an acoustic channel that acoustically couples the encased space to the surrounding environment, and the enclosure wall comprises a chemically etched insert molded metal portion that is mechanically interlocked and hermetically sealed to a plastic portion. The micro speaker further including a speaker assembly positioned within the encased space, the speaker assembly having a sound radiating surface facing the metal portion of the enclosure wall, a voice coil extending from the sound radiating surface, a magnet assembly having a magnetic gap aligned with the voice coil, and an acoustic chamber formed, in part, by the metal portion of the enclosure wall and the sound radiating surface.

Micro speaker having a hermetically sealed acoustic chamber with increased volume

Growing community of inventors

Cupertino, CA, United States of America

Derek C Krass