Semiconductor Components Industries, LLC

Der Min Liou

Sudhama C Shastri

Umesh Sharma

David D Marreiro

Phillip Holland

Rong Liu

Harry Yue Gee

Yenting Wen

Wenjiang Zeng

Ryan J Hurley

Li Jiang

Wang-Chang Albert Gu

A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component includes a transient voltage suppression structure that includes at least two diodes and a Zener diode. In accordance with embodiments, a semiconductor material is provided that includes an epitaxial layer. The at least two diodes and the Zener diode are created at the surface of the epitaxial layer, where the at least two diodes may be adjacent to the Zener diode.

Method for manufacturing a semiconductor device

A semiconductor component and methods for manufacturing the semiconductor component that includes a three dimensional helically shaped common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.

Method of manufacturing a semiconductor component and structure

A semiconductor component and methods for manufacturing the semiconductor component that includes a monolithically integrated common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.

Method for manufacturing a semiconductor component that includes a common mode choke and structure

Growing community of inventors

San Jose, CA, United States of America

Der Min Liou