Samsung Electro-mechanics Co., Ltd.

Deok Man Kang

Jin Su Park

Mi Sun Hwang

Chang Hwa Park

Chi Seong Kim

Jun Hyeong Jang

Jae Heun Lee

Gun Hwi Hyung

Eun Heay Lee

Yo Han Song

A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.

Substrate with electronic component embedded therein

An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and a stopper layer. An electronic component is disposed in the cavity. The stopper layer includes a first metal layer embedded in the first insulating body and having a portion of an inner surface exposed from the first insulating body, and a second metal layer disposed below the first metal layer and having at least a portion of an upper surface disposed as a bottom surface of the cavity. The cavity has an inner surface of the first metal layer and an inner surface of the first insulating body as a first wall surface and a second wall surface, respectively, and an inclination of the first wall surface is different from an inclination of the second wall surface.

Electronic component embedded substrate

Growing community of inventors

Suwon-si, South Korea

Deok Man Kang