Samsung Techwin Co., Ltd.

Deok-heung Kim

Woo-suk Choi

Sang-min Lee

Doc-Hwa Na

Bong-hui Lee

Chang-gyoo Kim

Young-duck Kwon

Seung-seob Lee

Provided is a method of roll-to-roll processing of semiconductor parts, the method including: supplying to a processing unit a first material uncoiled from a first roll for processing at the processing unit; connecting a leading board to a leading portion of the first material before the processing so that the first material led by the leading board is processed during transfer in the processing unit along a path; cutting the leading board from the leading portion of the first material after the processing; and if a terminal edge of the first material begins to be processed at the processing unit, connecting another leading board to a leading portion of a second material uncoiled from a second roll and supplying the second material to the processing unit for processing.

Apparatus for roll-to-roll manufacturing semiconductor parts and feeding method thereof

Provided are a circuit board and a method of manufacturing the same. The method includes: forming a pad portion and a lead line portion of a metal on an insulating substrate, wherein the lead line portion is connected to the pad portion; forming a conductive layer on the pad portion and the lead line portion, wherein the conductive layer has an upper surface comprising gold; forming an etching mask on the conductive layer so as to expose a portion corresponding to the lead line portion in the conductive layer; etching a portion of the lead line portion exposed by the etching mask and a portion of the conductive layer corresponding to the lead line portion using an etching solution containing an acid; and removing the etching mask.

Circuit board and method of manufacturing the same

A circuit board and a method of manufacturing the circuit board are provided. The method includes forming at least one protruded bump on a first side of a conductive board, forming a dielectric layer on the first side of the conductive board where the at least one bump is formed so as to cover the at least one bump; and etching a second side of the conductive board so as to partially remove the board to form a pattern.

Method of manufacturing a circuit board

In one aspect, a roll-to-roll substrate transfer apparatus is provided that includes: a feed roll and a take-up roll between which a printed circuit board substrate extends; and a plurality of drive roller rows transmitting motive power to the substrate for moving the substrate in a transferring direction, each drive roller row of the plurality includes a roller axis arranged in a direction perpendicular to the transferring direction of the substrate, and a plurality of spaced-apart drive rollers on the roller axis, wherein drive rollers of one drive roller row are arranged in spaces between drive rollers of adjacent drive roller rows. In other aspects, a wet etching apparatus and an apparatus for manufacturing a printed circuit board that include the roll-to-roll substrate transfer apparatus are provided.

Roll-to-roll substrate transfer apparatus, wet etching apparatus comprising the same and apparatus for manufacturing printed circuit board

A flexible printed circuit board (FPCB) which prevents a short circuit due to a crack in a bending portion is provided. The FPCB includes an end portion, a bending portion extended from the end portion, and a circuit portion extended from the bending portion. The improved FPCB includes a base film which is flexible and comprises a first via-hole formed adjacent to the end portion and the bending portion and a second via-hole formed adjacent to the bending portion and the circuit portion, a first conductive layer formed on an outer surface of at least the end portion and the bending portion, a cover layer formed on the first conductive layer, a second conductive layer which is formed on an inner surface of the end portion and is electrically connected to the first conductive layer through the first via-hole, and a third conductive layer which is formed on an inner surface of the extension circuit portion and is electrically connected to the first conductive layer through the second via-hole.

Flexible printed circuit board

An IC card includes an antenna circuit pattern formed on an insulation film and having a wire-shaped antenna portion, a portion corresponding to a chip bump of a combi-chip, and an attachment portion to which an external contact pad is attached. The combi-chip is attached to a portion corresponding to the chip bump of the combi-chip module on the antenna circuit pattern. At least one dielectric layer is attached to the antenna circuit pattern. An external contact pad is inserted in a hole formed in part of the dielectric layer and attached to the hole and has terminals formed in an outer surface and an inner surface of a substrate and connected to one another. The terminals on the inner surface contact the attachment portion is provided on the antenna circuit pattern.

Growing community of inventors

Changwon, South Korea

Deok-heung Kim