Mk Chem & Tech Co., Ltd

Mk Chem & Tech

Deok-Gon Han

Tae-Ho Lee

Tae-Hyon Sung

Hyuk-Suk Kwon

Jong-Han Song

Tae-Hyun Sung

A substitution gold plating solution for performing uniform gold plating directly on copper wiring of a printed circuit board is provided and a gold plating method using the same is provided, the solution comprising a purine-based compound or a pyrimidine-based compound having a carbonyl oxygen used as a localized corrosion inhibitor, a water-soluble gold compound, an aminocarboxylic acid as a complexing agent, a dicarboxylic acid as a conductivity improving agent, an &#x3b1;-hydroxycarboxylic acid and heteroaryl carboxylic acid as a base metal elution and reprecipitation preventing agent, a sulfite compound as a gold ion stabilizer, an axole compound as a surface corrosion inhibitor, other surfactants, crystal regulators, pH adjuster, and buffers. The substitution-type electroless gold plating solution according to the present invention prevents the localized corrosion of the copper surface, which is the base metal, and thus the gold plating film produced is excellent in solder mounting reliability.

Substitution-type electroless gold plating solution containing purine or pyrimidine-based compound having carbonyl oxygen and substitution-type electroless gold plating method using the same

The present invention relates to an electroless gold plating liquid, which may form gold plating without corrosion of a base metal by performing substitution and reduction reactions in the same bath, and satisfy both weldability of lead-free soldering and wire bonding characteristics, and has excellent stability such that a gold deposition rate may be continuously maintained.

Electroless gold plating liquid

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Siheung-si, South Korea

Deok-Gon Han