Flextronics Ap, LLC

Dennis Willie

David Geiger

Anwar Mohammed

Murad Kurwa

Richard Loi

Chris Stratas

Hector Rene Marin Hernandez

Susan Abraham

Weifeng Liu

Gervasio Mutarelli

Cat Le

Tilak Gopalarathnam

A stirring device and method for stirring a material using an applicator with an electrically controllable element placed on an outside surface of the applicator so that a controllable power source coupled to the electrically controllable element provides a controlled electrostatic charge to the element. The controlled electrostatic charge provided by the power source creates a variable electric field exterior to the outside surface of the applicator. The variable electric field induces a stirring movement to the material.

Stirring device and method using electrostatic charge

A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology. The formed graphite sheet is shaped to selective direct impinging heat. The heat can be directly away from the entire electronic component. Alternatively, the heat can be selectively directed away from some portions of the electronic component and toward other portions of the electronic component.

Graphite sheet to redirect SMT components during thermal exposure

Two substrates are mechanically and electrically coupled together using a combination of a fast cure electrically non-conductive epoxy for mechanical attachment and a slow cure electrically conductive epoxy for electrical interconnects. The two epoxies are selectively applied between the two substrates as a stack, and the stack is subjected to a temperature that is sufficient to cure the fast cure electrically non-conductive epoxy in a short period of time but does not damage the substrates or components coupled thereto. In some applications, the temperature is less than 100 degrees Celsius and the time period is less than 5 seconds. The stack is removed from the heat and the slow cure electrically conductive epoxy continues to cure over a longer second period of time, such as a few hours to a day.

Fast cure conductive epoxy attach methodology for high speed automated processes

A test apparatus and method for testing a shoe comprises a base, with a shoe fixture for fixing a shoe against displacement, and an actuator, including a shoe contactor, mounted to the movable portion of the actuator connected to the base so that a shoe fixed to the shoe fixture can be placed in alternating stress conditions. The movable portion of the actuator is displaceable between a first position in which the shoe contactor is positioned away from the shoe fixture and a second position in which the shoe contactor is positioned proximate to the shoe fixture to contact and deflect the shoe.

Shoe testing apparatus

A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology.

Graphite sheet to protect SMT components from thermal exposure

Methods and devices for removing entrapped bubbles or air in photovoltaic solar cells during a manufacturing process including an encapsulation process include, for example, wiggling the photovoltaic solar cells or pushing out air bubbles by applying vibrations and/or light pressures. Optional additional steps include liquid wetting or dispensing to or around the photovoltaic solar cell matrix for air releasing before the placement of the matrix into a liquid for encapsulation.

PV module cell matrix placement station and methods for removing air or bubbles during the manufacturing process

In one embodiment, a method for soldering photovoltaic solar cells includes providing a first and second PV cell, a holder, soldering ribbon and a mass reflow oven. The method further includes placing the soldering ribbon in a fixture groove in the holder. The method further includes placing the first and second PV cell in the holder such that the soldering ribbon is position in a desired position on the first and second PV cell. The method further includes placing the holder and the first and second PV cell with the soldering ribbon into the mass reflow oven. The method further includes heating the holder and the first and second PV cell with the soldering ribbon in the mass reflow oven to solder the first and second PV cell. The method further includes cooling the holder and the first and second PV cell with the soldering ribbon.

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San Jose, CA, United States of America

Dennis Willie