Microsoft Technology Licensing, LLC

Coolit Systems, Inc.

Dennis Trieu

Kathryn M Oseen-senda

Husam Atallah Alissa

Nicholas Andrew Keehn

Douglas Patrick Kelley

Bharath Ramakrishnan

Ioannis Manousakis

Alexis Grace Schubert

Eric Clarence Peterson

Christian L Belady

Brydon Gierl

Martha Geoghegan Peterson

Cameron S Turner

Sebastian Varela Benitez

Mark Edward Shaw

Craig Steven Ranta

Seyed Kamaleddin Mostafavi Yazdi

Kathryn Midori Oseen-Senda

Kamal Mostafavi

A heat sink includes a body with an expansion chamber therein. The body is configured to receive heat from a heat source. The expansion chamber is configured to expand a working fluid from an inlet port to an outlet port of the heat sink. An immersion system includes a heat sink and a pressurizing mechanism for pressurizing the working fluid prior to the inlet port.

Systems and methods for two-phase cooling of electronic components

The discussion relates to busbars that are protected from unintentional contact. One example includes a liquid immersion tank and a protected automatic busbar assembly positioned in the liquid immersion tank. The protected automatic busbar assembly can include a conductor and a deployable protector biased over the conductor. The example can include a computer that includes a device controller and an electrical connector. The device controller can be configured to overcome the bias and cause the deployable protector to transition away from the conductor to allow the conductor to be engaged by the electrical connector to couple the computer to the conductor of the protected automatic busbar assembly.

Protected busbars

A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.

3-D structured two-phase microfluidic cooling with nano structured boiling enhancement coating

A pump tray has a liquid pump with an inlet and outlet. A blindly matable liquid coupler fluidicly couples with the pump inlet and a blindly matable liquid coupler fluidicly couples with the pump outlet. A chassis of the pump tray has an alignment member configured to removably engage with another device and to restrict, to a limited number of degrees-of-freedom, movement of the chassis relative to the other device (e.g., a liquid pumping unit). The blindly matable liquid couplers are so physically coupled with the chassis as to inhibit movement of them relative to the chassis. A liquid pumping unit also has a chassis defining a bay configured to receive a pump tray, a liquid inlet coupler and a liquid outlet coupler, and a reservoir fluidicly coupled with the liquid inlet coupler. A blindly-matable liquid coupler fluidicly couples with the reservoir outlet and a blindly-matable liquid coupler fluidicly couples with the liquid outlet coupler. An alignment member is configured to removably engage with the pump tray and to restrict, to a limited number of degrees-of-freedom, movement of the pump tray relative to the chassis of the liquid pumping unit.

Liquid pumping units, and related systems and methods

A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.

3-D structured two-phase cooling boilers with nano structured boiling enhancement coating

A method of thermal management of a computing device includes immersing a first electronic component of the computing device in a first working fluid contained in a first volume, immersing a second electronic component of the computing device in a second working fluid contained in a second volume, and changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.

Systems and methods for thermal management of high-capacity devices in immersion-cooled datacenters

The description relates to cooling electronic components, such as computing devices. One example includes a rack defining a volume and multiple sealed chassis modules removably fluidly coupled to a two-phase condenser tank via a vapor coupler and a liquid coupler. Individual sealed chassis modules can contain one or more electronic components immersed in two-phase coolant that when heated by operation of the electronic components experiences a phase change from a liquid phase to a gas phase and travels to the two-phase condenser tank via the vapor coupler and is cooled in the two-phase condenser tank until experiencing a phase change back into the liquid phase. Individual sealed chassis modules can be decoupled from the two-phase condenser tank without releasing two-phase coolant and an entirety of the multiple sealed chassis modules and the condenser tank are contained in the volume of the rack.

Computer cooling

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Calgary, Canada

Dennis Trieu