Raytheon Company

Dennis Robert Kling

Bruce William Chignola

Boris Solomon Jacobson

David J Katz

Jorge M Marcial

Leonard Schaper

Kevin Martin

Donald H Desrosiers

William E Wesolowski

Eberhardt Praeger

Christopher D Cotton

Garo Dakessian

Kevin Edward Martin

William Edward Wesolowski

An improved microelectronic assembly () and packaging method includes a device package for housing a semiconductor die or chip, (), an array of passive electronic components (-) operating in cooperation with the flip chip semiconductor die () and housed inside the device package to decouple noise from input signals, and a heat spreader () disposed between a top surface of the semiconductor die () and a package cover (). The semiconductor die () is configured as a flip chip die and the device package includes a package substrate () configured as a ball grid array. The improved microelectronic device () reduces parasitic inductance in electrical interconnections between the semiconductor die and an electrical system substrate () and reduces signal noise in mixed signal high frequency analog to digital converters operating at clock rates above 1 GHz.

Low noise high thermal conductivity mixed signal package

An embedded core electrical transformer () for DC to DC current conversion at a switching frequency of 1 MHz has reduced volume and weight with increased power density. The electrical transformer () utilizes a plurality of conductive elements () disposed inside a hollow cavity () used to embed two magnetic cores (). The conductive elements () encircle three sides of the embedded cores () and interface with a multilayer PCB () which includes conductive traces formed therein to encircle a fourth side of the embedded cores and to form primary and secondary winding circuits.

Fabrication method and structure for embedded core transformers

An electrical transformer having primary winding segments and secondary winding segments interconnected, respectively, by first and second multilevel printed circuit boards disposed in a pair of overlaying planes and additional segments disposed perpendicular to the overlaying planes.

Electrical transformer

The invention provides systems and methods for interconnecting circuit devices, wherein decoupling capacitors are disposed on a substrate and an interconnect layer having a pattern of circuit connections is formed by a deposition process over the capacitors thereby embedding the decoupling capacitors within the interconnect layer. Circuit devices can be mounted to the surface of the deposited interconnect layer at locations that minimize, or substantially minimize, the interconnect length between the chip device and the decoupling capacitors for that circuit device.

Embedded capacitor multi-chip modules

Growing community of inventors

Milford, MA, United States of America

Dennis Robert Kling