International Business Machines Corporation

Hitachi Global Storage Technologies Netherlands B.v.

Hitachi Global Storage Netherlands, B.v.

Other

Hoechst Celanese Corporation

Clariant Finance (bvi) Limited

C3nano Inc.

Dennis R McKean

Robert Dennis Miller

Willi Volksen

James L Hedrick

Craig Jon Hawker

Teddie Peregrino Magbitang

Carlton G Willson

Alfred Floyd Renaldo

Michael William Chaw

Dan Dawson

Cherngye Hwang

Kim Yang Lee

Phillip Joe Brock

Jennifer Lu

Richard I Palmisano

Mark Whitney Hart

Wesley LeRoy Hillman

Bulent Nihat Kurdi

Eun K Row

Gary John Suzuki

Ralph R Dammel

Gregory Michael Wallraff

Qing Dai

Andrew M Homola

Richard Vicari

Sally Ann Swanson

Barton Allen Smith

Li Fei Zheng

Robert J Twieg

Joseph Grover Gordon, Ii

William D Hinsberg, Iii

Arthur F Diaz

Lawrence B Schein

Nicholas J Clecak

Robert John Wilson

Saad K Doss

Terry C Tompkins

Douglas J Gordon

Jing X Sun

Robert David Allen

Gregory Breyta

Bradley Leonard Beach

Timothy C Reiley

Ying-Syi Li

Douglas Johnson Werner

Jyh-Shuey Jerry Lo

Ajay Virkar

Xiqiang Yang

Ajay Kanubhai Suthar

Nicholas Ian Buchan

Gary Miles McClelland

Scott Arthur MacDonald

Hubert Schlosser

Anna Marie Pearson

Jeffrey W Labadie

Brad Jackson

Jila Tabib

Ping-Wei Chang

Richard B Watkins

Melburne C LeMieux

Jorge Goitia

Sean Clemenza

Mark Clinton Thurber

Eric Keith Wong

Shi Ning

Seong-Jin Kim

Joseph G Walsh

Kenneth L Larson

Adolfo R Gutierrez

Reduction/oxidation reagents have been found to be effective to chemically cure a sparse metal nanowire film into a fused metal nanostructured network through evidently a ripening type process. The resulting fused network can provide desirable low sheet resistances while maintaining good optical transparency. The transparent conductive films can be effectively applied as a single conductive ink or through sequential forming of a metal nanowire film with the subsequent addition of a fusing agent. The fused metal nanowire films can be effectively patterned, and the patterned films can be useful in devices, such as touch sensors.

Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks

A method for forming a planarized surface for at least one bar of sliders for utilization in a hard disk drive is disclosed. In general, at least one bar of sliders is placed on an adhesive layer. A single thermoplastic layer is then provided above the at least one bar of sliders. The single thermoplastic layer is then heated to a softening temperature such that the single thermoplastic layer will flow between the at least one bar of sliders. The single thermoplastic layer is then cooled to form a planarized surface of both said single thermoplastic layer and said at least one bar of sliders at said adhesive layer.

Forming a planarized surface for at least one bar of sliders

Patterning a surface, comprising at least one feature having silicon coupled to a substrate, is described herein. In one embodiment a method is described for patterning a surface which comprises at least one feature having silicon and at least one feature having carbon coupled to a substrate. The surface is coated with 3-(trimethoxysilyl)propyl methacrylate, and a photoresist is applied the 3-(trimethoxysilyl)propyl methacrylate coated surface. The photoresist is imaged and the surface is etched. The photoresist is then removed.

Patterning a surface comprising silicon and carbon

A read sensor for a magneto resistive head is formed through the use of a bilayer lift-off mask. According to one embodiment, a release layer is formed on top of a sensor layer. A silicon-containing resist layer is formed over the release layer. The resist layer is patterned according to the desired dimensions of the read sensor. Then, plasma etching, such as oxygen plasma etching, is used to remove the portion of the release layer that is exposed by removal of resist material. The release layer may be etched to undercut the patterned resist layer, or may entirely removed beneath the patterned resist layer to provide a bridge of the resist material. In either case, isotropic plasma etching, anisotropic plasma etching, or some combination thereof may be applied.

Method for manufacturing a read sensor for a magnetoresistive head

A method is presented for repairing damaged photomasks for electronic component fabrication processes, particularly for fabrication of the ABS of a disk drive slider. The method includes applying an overcoat of material having index of fraction which is close to the index of refraction of the photoresist material of the damaged photomask to produce a non-scattering boundary surface. The overcoat material preferably includes an overcoat base material which is a polymer having an index of refraction which is in the range of plus or minus 0.1 from the index of refraction of said photoresist material.

Method for repairing photoresist layer defects using index matching overcoat

Methods of forming a component of a thin film magnetic head and improving the plating of a component of a thin film magnetic head are provided. The methods include the use of a high activation energy chemically amplified photoresist (CARS) that is contacted with a low pH high saturation magnetic moment plating solution to form a magnetic head component that is essentially free of plating defects. The methods find utility in hard disk drive applications, such as in the manufacture of magnetic poles for the write head of a hard disk drive.

Elimination of write head plating defects using high activation chemically amplified resist

A method for creating segmented resist islands for photolithography on single sliders is disclosed. The method includes ramping the temperature of a number of single sliders, to a temperature that is below a proper softbake temperature. The single sliders reside in a divider and the single sliders and walls of the divider have a layer of resist deposited on them. Coarse lithography is then performed to remove the resist from above portions of the walls of the divider; and the temperature of the single sliders, the resist and the divider is then ramped to a proper softbake temperature.

Segmented resist islands for photolithography on single sliders

In one illustrative example, a method for use in making a magnetic write head includes the steps of forming a first pole piece layer of a first pole piece; forming a patterned resist over the first pole piece layer; electroplating a pedestal over the first pole piece layer within a channel of the patterned resist; electroplating a metal gap layer over the pedestal within the channel of the patterned resist; forming a resist channel shrinking film over the patterned resist; baking the resist channel shrinking film over the patterned to thereby reduce a width of the channel; removing the resist channel shrinking film; electroplating a second pole piece within the reduced-width channel of the patterned resist; removing the patterned resist; and milling the pedestal, using the second pole piece as a mask, to form a central notched pedestal having side walls with angled slopes.

Methods of making magnetic write heads with use of linewidth shrinkage techniques

An encapsulant fluid is provided comprising a mixture of a diene-containing compound and a dienophilic compound. At least one of the diene-containing and the dienophilic compounds is protected so that the compounds do not substantially react with each other at room temperature. The diene-containing and the dienophilic compounds undergo a reversible Diels-Alder polymerization reaction at a polymerization temperature above room temperature to form a solid debondable polymeric encapsulant. Also provided are methods for forming slider assemblies and methods for patterning a slider surface using the encapsulant.

Stable encapsulant fluid capable of undergoing reversible Diels-Alder polymerization

A method is provided for planarization of structures which minimizes step heights, reduces process steps, improves cleanliness, and provides increased ease of debond. Structures are placed with working surfaces facing down onto an adhesive layer such that structures remain fixed during heating. A bi-layer encapsulating film is used to achieve planarization. A carrier is bi-laminated with a thermoplastic film layer followed by a chemically inert protective polymer film layer that can withstand etch and cleaning processes. The thermoplastic layer is laminated on top of the carrier; the polymer layer is laminated on top of the joined thermoplastic layer and carrier. The carrier with bi-layer film is then placed onto the backside of the structures to resist chemical attack from the front side during photostrip and enable planarization. When heat is applied, the bi-layer encapsulating film melts and pushes the polymer layer into the gaps between structures thereby achieving complete planarization.

Planarization method for a structure having a first surface for etching and a second surface

The present invention relates to a method for producing a transducer slider. The method involves first coating a substrate with a radiation-sensitive layer and exposing the radiation-sensitive layer to radiation according to an intensity pattern. Preferably, the intensity pattern is provided using a grayscale mask. Once the image is developed into the radiation-sensitive layer, the image is transferred into the substrate to form a transducer slider having a surface profile comprising a tapered edge. In the alternative or in addition, the surface profile may comprise a rounded corner. The invention also relates to a structure for forming a transducer slider.

Method for producing a transducer slider with tapered edges

A process to reduce step heights in planarization of thin film carriers in an encapsulation system. The improvements include using an adhesive tape having a thinner adhesive thickness and a stiffer tape for the film sealing the encapsulant on the carrier to result in a low step height surface transition between the carrier and the cured encapsulant. The composition of the encapsulant is modified to reduce the shrinkage upon curing of the encapsulant. The encapsulant may include an absorbent that absorbs the irradiation and cause the top surface to harden first compared to the bulk of the encapsulant, and/or a gas-emitting additive that creates gaseous products that expand upon irradiation to thereby reduce the shrinkage of the encapsulant upon curing. Alternatively, irradiation at very low incidence angle relative to the top surface of the encapsulant causes the top surface to harden before the bulk of the encapsulant.

Planarization in an encapsulation process for thin film surfaces

The invention relates generally to the bonding of one or more sliders in styrene and butadiene polymers. More particularly, the invention relates to planarized slider assemblies formed by using debondable solid encapsulants comprised of styrene and butadiene polymers. The invention also relates to methods that use such encapsulants in conjunction with resists to produce magnetic head sliders having patterned air-bearing surfaces.

Sliders bonded by a debondable encapsulant containing styrene and butadiene polymers

A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant comprised of different first and second polymers The solid encapsulant is comprised of a polymer prepared by polymerizing an encapsulant fluid comprising a homogeneous mixture of first and second constituents. The first constituent is comprised of a first monomer suitable for in situ polymerization to form the first polymer. The second constituent is comprised of the second polymer or a second monomer suitable for in situ polymerization to form the second polymer. The first constituent does not substantially react with the second constituent. Each slider has a surface that is free from the encapsulant. The encapsulant-free surfaces are coplanar to each other. Also provided are methods for forming the assembly and methods for patterning a slider surface using the encapsulant.

Sliders bonded by a debondable encapsulant comprising different polymers formed via in situ polymerization

A method for manufacturing thin-film magnetic head sliders is disclosed. Initially, an elastic layer, which may be made of poly-dimethyl siloxane (PDMS), is spun on a wafer and is thermally cured. Then, a resist layer is spun on the elastic layer. Both the resist layer and the elastic layer are subsequently peeled off together from the wafer. Next, the peeled resist layer/elastic layer is applied onto a group of magnetic heads with the resist layer in direct contact with the magnetic heads. Finally, the elastic layer is peeled off from the resist layer such that the resist layer remains attaching to the magnetic heads.

Method for manufacturing thin-film magnetic head sliders

Growing community of inventors

San Jose, CA, United States of America

Dennis R McKean