Freescale Semiconductor,inc.

Dennis O Kiffe

Addi B Mistry

James H Kleffner

Daryl R Wilde

Joseph M Haas

A semiconductor package assembly has an intervening package ( ) that may be connected to a first package ( ) from a first substrate ( ) on a first side of the package ( ) and to a second package ( ) from a second substrate ( ) on a second, opposing side of the package ( ). Electrical contact to a semiconductor die ( ) is made from the first side by wire bonding to wire bond posts ( ) and by balls ( ) from the second side. Electrical contact from one side of the intervening package ( ) to the other may be made by bypassing the die. Electrical contact on either side of the intervening package may be made both within and outside the footprint of the semiconductor die ( ).

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Leander, TX, United States of America

Dennis O Kiffe