Samsung Electronics Co., Ltd.

Samsung Austin Semiconductor, LP

Dennis Michael Winters

Matthew Burnham

Daniel Thevis

Luis Alberto Hurtado

Surya Rajendran

Victor Coots

A system to process semiconductor wafers includes an end effector, a proximity sensor and a controller. The end effector may be adapted to handle a semiconductor wafer. The proximity sensor may be attached to the end effector and may output a first sensor signal if a distance between the end effector and an object separated from the end effector is less than or equal to a first predetermined distance. The controller is responsive to the first sensor signal to slow a movement of the end effector. The proximity sensor further outputs a second sensor signal if the distance between the end effector and the object is less than or equal to a second predetermined distance in which the second predetermined distance being less than the first predetermined distance. The controller is responsive to the second sensor signal to stop movement of the end effector.

Proximity robot blade detection and auto retraction

A semiconductor manufacturing equipment comprising trace elements and method of manufacture are disclosed. The semiconductor manufacturing equipment includes one or more components, wherein at least one component is made from an alloy comprising one or more materials and one or more rare earth elements (REEs). The alloy comprises predetermined quantities of the respective REEs. The method for manufacturing a component includes forming an alloy comprising at least one material and one or more selected rare earth elements (REEs) and building the component with the alloy.

Semiconductor manufacturing equipment with trace elements for improved defect tracing and methods of manufacture

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Round Rock, TX, United States of America

Dennis Michael Winters