Teccor Electronics, LP

Dennis M McCoy

Kelly C Casey

Darren J Daugherty

Monty F Webb

Paul A Langer

By Carol G McCoy

Kurt A Wattelet

Disclosed is a module () having pins () connected to respective conductor tower strips (). Pairs (and) of the conductor tower strips are spring biased toward each other to capture therebetween respective PTC current limiting elements (). A spring memberis connected to a ground pin () at one end, and to an overvoltage sensitive assembly at the other end, via a soldered heat transfer member (). The overvoltage sensitive assembly includes overvoltage semiconductor devices () soldered thereto. When an overvoltage condition is sensed, the heat generated by the devices melts the solder between the heat transfer member () and the spring member (), whereby lateral arms () of the spring member () move and engage the conductor tower strips (). The tip and ring pins () of the module () are not only shorted together, but are shorted to ground.

Primary telephone line protector with failsafe

A telephone line protection element constructed of three lead frames having contact fingers for holding therebetween a semiconductor cell providing overvoltage protection between the telephone line and the customer circuits. The lead frames are soldered to a resistive semiconductor material to provide a fail-safe mechanism that mechanically connects either the tip or ring telephone line conductors to ground if a sufficient overcurrent exists. In response to an overcurrent, the resistive semiconductor material generates heat and melts the solder in contact therewith, which allows a pre-bent member of the lead frame to move in contact with a ground terminal, thereby shunting the overcurrent to ground. The entire protection element includes very few components and is efficiently assembled and attached to the pins of a 5-pin module.

Primary telephone line protector with fail safe

A telephone line protection module having a printed circuit board base with conductive paths connected to pins of the module. Overvoltage sensitive semiconductor devices are soldered to the ends of a conductive bridge, and the bridge is spring-biased between a module cover and the conductive bridge. The semiconductor devices are thus forced into electrical contact with the printed circuit paths. In addition, in the event the semiconductor devices are thermally destroyed, the conductive bridge is forced by the spring into direct contact with the printed circuit paths.

Telephone line surge protector

A semiconductor device soldered to a conical mounting pedestal of a metal substrate reduces the lateral shearing stress created by temperature changes. An angle between the bonding surfaces of the semiconductor device and the metal substrate can be selected as a function of the coefficients of thermal expansion of the device and substrate materials.

Semiconductor chip-substrate attachment structure

Telephone line protection element

A semiconductor device soldered to a conical mounting pedestal of a metal substrate reduces the lateral shearing stress created by temperature changes. An angle between the bonding surfaces of the semiconductor device and the metal substrate can be selected as a function of the coefficients of thermal expansion of the device and substrate material.

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Dallas, TX, United States of America

Dennis M McCoy