Securaplane Technologies, Inc.

Meggitt (rockmart) Inc.

Dennis Keith Moxley

Thomas David Black

Timothy L Ash

Sarajin Ali

Brandon Ross Mahoney

Andrew Keith Dickerson

Louis Aúgusta Girard, Jr

A method of making an electronics enclosure that is light-weight, structurally sound and EMI resistant is provided. Preferably the electronics enclosure is made by covering the walls of a mold for the chassis and the lid with a metallic mesh. At least two plies of carbon prepreg are applied over the metallic mesh. The carbon prepreg and metallic mesh are then cured together at high temperature, typically in an autoclave. The wire mesh becomes integrated into the composite material during the curing process when the carbon material shrinks to the mold and the epoxy bonds with the wire mesh. The molds may then be removed leaving an electronics enclosure with superior properties.

Composite electronics cases and methods of making and using the same

A composite part includes a first composite section and a second composite section connected by a flexible section. The first composite section has a laminated structure including multiple layers of reinforcement material supported by a matrix material. The second composite section has a laminated structure including multiple layers of reinforcement material supported by a matrix material, and a flexible composite section joins the first composite section to the second composite section. The flexible composite includes multiple layers of a fabric material supported by a flexible elastomer. The multiple layers of the fabric material overlap with the first composite section and the second composite section by being layered in between at least a portion of the multiple layers of reinforcement material forming the laminated structures of the first composite section and the second composite section.

Composite parts joined by a flexible construct

Growing community of inventors

Dallas, GA, United States of America

Dennis Keith Moxley