International Business Machines Corporation

Dennis James Wurth

Don Alan Gilliland

David B Johnson

Matthew Stephen Doyle

Roger Allen Booth, Jr

Thomas W Liang

Joseph F Prisco

Cary Huettner

Eric B Swenson

Rosanna Mannan

Edward Charles Gillard

Ross Thomas Fredericksen

Ankur Kanu Patel

Lynn Robert Landin

Andrew James Frana

Brian Edward Gregg

An apparatus includes a memory and a hardware processor communicatively coupled to the memory. The hardware processor receives, from a plurality of power supplies, a plurality of indications of electrical power disturbances detected by the plurality of power supplies and determines locations of the plurality of power supplies based on the plurality of indications. The hardware processor also determines, based on the plurality of locations, an event that caused the electrical power disturbances and classifies the event based on the location of the plurality of power supplies.

Detecting electrical power line disturbances

An air valve may include a sheet on a panel that serves as a portion of one wall of an air-cooled enclosure. The panel has a first aperture, having a first radius. The sheet may be deformable and resilient, and have a conductive film on one surface and a second aperture. A plurality of leaves lie in a plane parallel to the panel and extend inwardly a particular distance from a perimeter define the second aperture. The perimeter has a second radius equal to the first radius. The particular distance is less than the second radius. The leaves may deform in response to airflow. The second aperture has a first diameter and first depth in an un-deformed state, and a second diameter and second depth in a deformed state. The second diameter and second depth are greater than the first diameter and first depth.

Resilient deformable air valve

In an approach for identifying an object using an electromagnetic tag, an electromagnetic signal is received by a sensor, wherein the electromagnetic signal originates from an electromagnetic tag affixed to an object, and wherein the electromagnetic signal passes through a physical propagation channel. A processor searches a database for an electromagnetic signature corresponding to the electromagnetic signal, wherein the database comprises, at least, object information associated with the electromagnetic signature. A processor determines the electromagnetic signal corresponds to the electromagnetic signature. A processor presents the object information associated with the electromagnetic signature.

Object identification through electromagnetic tag signature

Methods and structures are provided for implementing feed-through and domain isolation using ferrite and containment barriers. A vertical isolator is provided between a first domain and a second domain on a printed circuit board with signals passing between the first domain and the second domain. The vertical isolator is placed over a domain separation gap between the first and second domains in the printed circuit board, the vertical isolator having a vertical isolation barrier between a first vertical plate coupled to the first domain and a second vertical plate coupled to the second domain. The vertical isolation barrier is formed of a unitary ferrite block or a non-conductive magnetic absorber material. A plurality of capacitance feed-through plates and a dielectric material are provided within the vertical isolator.

Implementing feed-through and domain isolation using ferrite and containment barriers

A grounded belt and drawer apparatus including a drawer, mounted on a first track, a tensioner body having a first pulley, a supporting member, and a first belt. The drawer moveable on a first line in a first direction and a second direction. The tensioner body mounted on a second track and moveable in the first direction and the second direction. The first belt having a first end and a second end, rounded over the first pulley, and a first segment and second segment extending distally from the first pulley in the first direction. The first belt conductively connected to the drawer and to a first fixed point which forms a conductive path from the drawer to the first fixed point.

Grounded belt and movable drawer apparatus

According to embodiments of the invention, a heat sink structure may be provided. The heat sink structure may include a first surface adapted to connect to an electronic component. The heat sink structure may also include a second surface adapted to provide heat transfer. The heat sink structure may also include a coating of radio-frequency absorbing material covering at least a portion of the second surface.

Heat sink structure with radio frequency absorption

A method and structures for implementing an adjustable size ferrite core for electromagnetic interference (EMI) cable noise suppression. A plurality of ferrite core segments are mated together defining an adjustable size cable receiving cavity. Each of the ferrite core segments includes an inner wall portion with mating fingers extending along adjoining edges. The mating fingers are selectively positioned together to select a size of the adjustable cable receiving cavity.

Implementing adjustable size ferrite core for EMI cable noise suppression

A method and structure are provided for implementing surface mount components with symmetric reference balance. A first reference and an incoming signal are received in a surface mounted device (SMD) package and a second reference and the outgoing signal are output from the SMD package. A capacitor structure is defined within the SMD package between the first reference and the second reference. The capacitor structure includes a balanced impedance structure between the first reference and the second reference. A component connected between the received incoming signal and output signal is generally centrally located within the capacitor structure.

Implementing surface mount components with symmetric reference balance

An electrical cable includes a central ground core, an inner dielectric layer surrounding the central ground core, and a pair of signal conductor wires spirally wound on the inner dielectric layer. The signal conductor wires are separated from the central ground core by a thickness of the inner dielectric layer, and spaced apart from each other and parallel to each other. The cable further includes an intermediate dielectric layer disposed between the signal conductor wires and an outer dielectric layer surrounding the signal conductor wires and the intermediate dielectric layer.

Spirally wound electrical cable for enhanced magnetic field cancellation and controlled impedance

An apparatus, system, and method for managing cooling within a printed circuit board (PCB) enclosure. The system includes a PCB having a first surface on which electronic components are mounted. Multiple contour control actuators are fixedly disposed in a substantially planar array in z-axis opposition to the first surface of the PCB. Each of the contour control actuators has an extensible end that is electromechanically extendable in parallel with the z-axis normal to the first surface of the PCB. A substantially flexible sheet member is disposed between the extensible ends of the contour control actuators and the first surface of the PCB. The extensible ends contact the flexible sheet member such that the z-axis contour of the flexible sheet member is determined by the z-axis positions of the extensible ends. A contour controller adjusts the z-axis contour of the flexible sheet member by adjusting the relative positions of the extensible ends of one or more of the contour control actuators. The contour controller adjusts the relative positions of the extensible ends in accordance with thermal conditions proximate to the PCB.

Thermal management apparatus and method for printed circuit boards

Disclosed is an adjustable electrical connector. The connector includes a moveable structure including a plurality of return signal conductors disposed on a moveable block, and a fixed structure including a plurality of signal conductors. Each signal return conductor corresponds to and is electrically coupled to one of the plurality of signal conductors. The connector also includes a means for adjusting the electrical coupling of each signal conductor with the corresponding return signal conductor.

Adjustable impedance electrical connector

A modular heat sink and semiconductor chip assembly includes a semiconductor chip, a base plate disposed in a heat conducting relationship with the semiconductor chip and containing a plurality of slots extending through the base plate, a plurality of fins individually passed through a number of the plurality of slots and containing voltage-less input/output connections to facilitate grounding with the chip, and at least one electrical component passed through one of the plurality of slots and containing a high-density input/output structure on one edge and is electrically connected to the semiconductor chip.

Modular heat sink fin modules for CPU

A method and components are provided for implementing EMC shielded resonance damping of a printed circuit board. The EMC shielded resonance damping component includes a capacitor and resistor formed in series combination and contained within a shielded enclosure. A pair of coaxial pads is provided for connection to the printed circuit board. The series combination of the capacitor and resistor is connected between a first pad of a pair of coaxial pads and an interior wall of the shielded enclosure. The shielded enclosure provides a return current path to a second pad of the pair of coaxial pads through the series components.

Method and components for implementing EMC shielded resonance damping

A modular heat sink decoupling capacitor array includes a plurality of modules, each defining parallel distributed decoupling plates, and each module forming a heat sink fi. Each module includes multiple spaced apart contacts for providing low inductance connections with an associated device. A power distribution interposer module is attached to a heat sink surface of the modular decoupling capacitor. The interposer module is used for implementing power delivery without using valuable ball grid array (BGA) connections and printed circuit board (PCB) layers.

Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module

A wiring module includes a wire element selected from the group consisting of coaxial cable, a twisted pair of conductors, and a strip line conductor, a dielectric enclosure surrounding the wire element, a pin end having one or more pins in electrical communication with an end of the wire element; and, a receptacle end having one or more pin receptacles, disposed within one or more slots of the receptacle end, in electrical communication with another end of the wire element.

Growing community of inventors

Rochester, MN, United States of America

Dennis James Wurth