International Business Machines Corporation

Hitachi Global Storage Technologies Netherlands B.v.

Dennis G Manzer

Levente Klein

Hendrik F Hamann

Michael F Lofaro

Fernando Jimenez Marianno

Michael A Cobb

Timothy Joseph Chainer

Mahadevaiyer Krishnan

Peter Alfred Gruber

John Peter Karidis

Bucknell Chapman Webb

Sergio Adolfo Bermudez Rodriguez

Christopher Lee Tessler

Glen Nelson Biggs

James Anthony Tornello

Hans-Dieter Wehle

Dinesh R Koli

Jehuda Ish-Shalom

Paraneetha Poloju

Leonard A Katz

A method for determining a corrosion rate includes receiving an input signal including corrosion data from a sensor. A signal-to-noise ratio (SNR) and a type of noise is determined from the input signal. A corrosion rate computation method is selected based on the SNR and the type of noise. The corrosion rate is determined, using a processor, based on a selected corrosion rate computation method.

Real time numerical computation of corrosion rates from corrosion sensors

A system for increasing filter economy includes a memory configured to receive measurements of contaminants in an internal and an external environment. A cost effectiveness module is configured to determine a cost of a corrosion rate increase if unfiltered external air intake is increased for cooling, to determine a cost of increased air pressure to filter external air, and to determine if the cost of filtering external air exceeds the cost of the corrosion rate increase. An air intake module is configured to increase an intake of unfiltered external air if it is determined that the cost of filtering external air exceeds the cost of the corrosion rate increase.

Filter replacement lifetime prediction

Systems for predicting a filter lifetime. A filter monitoring system includes a filter effectiveness history based on contaminant sensor information associated with a filter received from one or more contaminant sensors. A lifetime module is configured to determine a rate of filter consumption based on the filter effectiveness history and to determine a remaining filter lifetime based on the determined rate of filter consumption.

Techniques for automatically and efficiently controlling air conditioning units (ACUs) in a data center are provided. In one aspect, a method for controlling ACUs in a data center is provided. The method includes the following steps. It is identified which of the ACUs in the data center comprise base ACUs and which of the ACUs in the data center comprise redundant ACUs. Output from one or more of the redundant ACUs is increased in response to one or more control events. Output from the redundant ACUs is decreased once a predetermined period of time has elapsed without a new control event occurring.

Automatic computer room air conditioning control method

Methods and systems for predicting a filter lifetime include building a filter effectiveness history based on contaminant sensor information associated with a filter; determining a rate of filter consumption with a processor based on the filter effectiveness history; and determining a remaining filter lifetime based on the determined rate of filter consumption. Methods and systems for increasing filter economy include measuring contaminants in an internal and an external environment; determining a cost of a corrosion rate increase if unfiltered external air intake is increased for cooling; determining a cost of increased air pressure to filter external air; and if the cost of filtering external air exceeds the cost of the corrosion rate increase, increasing an intake of unfiltered external air.

A method for cooling a data center having a plurality of racks and an adjustable cooling system includes the following steps. A minimum and maximum temperature is set for each of the racks. A temperature of each of the racks is determined based on i) a rate R(t) at which the chilled air at a temperature Tc is introduced to each of the racks and ii) a rate R at which warm air from each of the racks at a temperature T is returned to the cooling system. The cooling system is adjusted to add cooling or to reduce cooling to the data center. The determining and adjusting steps are repeated at a predetermined time interval to achieve and maintain the temperature of each of the racks to be greater than or equal to the minimum temperature and less than or equal to the maximum temperature.

Computer room cooling control

Systems, methods and devices directed to transformers are disclosed. One transformer system includes a set of transformer cells and a controller. The set of transformer cells is coupled in series to form a series coupling, where each transformer cell includes at least one first coil and at least one second coil. The second coil is configured to receive electrical energy from the first coil through magnetic interaction. The controller is configured to modify electrical aspects at ends of the series coupling by independently driving the transformer cells such that at least one of the transformer cells is driven differently from at least one other transformer cell in the set.

Integrated transformers

An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles.

Multi-spindle chemical mechanical planarization tool

A glass mold polishing structure and method. The method includes providing a polishing tool comprising mounting plate, a chuck plate over and mechanically attached to the mounting plate, and a pad structure over and mechanically attached to the chuck plate. A retaining structure is attached the chuck plate. A glass mold comprising a plurality of cavities is placed on the pad structure and within a perimeter formed by the retaining structure. A vacuum device is attached to the chuck plate. The vacuum device is activated such that a vacuum is formed and mechanically attaches the glass mold to the pad structure. The polishing tool comprising the glass mold mechanically attached to the pad structure is placed over and in contact with the polishing pad. The polishing tool comprising the glass mold is rotated. The glass mold is polished as a result of the rotation.

Glass mold polishing method and structure

A cooling system for a heat-generating device includes: coolant fluid; an evaporator for holding the coolant fluid and for heating the coolant fluid; said evaporator in close proximity to the heat-generating device for removing unwanted heat. The cooling system also includes a plurality of tubes for providing a flow path for the coolant fluid and gases produced by the evaporator; a heat exchanger through which the tubes pass for cooling the coolant fluid. The heat exchanger includes: a reservoir, a coolant, and a heating element for heating the gas so that it expands and pushes cool coolant fluid back to the evaporator. The heating element may be located inside the reservoir.

Thermally pumped liquid/gas heat exchanger for cooling heat-generating devices

An apparatus for placing solder bumps on a mold plate includes: a solder fill head configured for dispensing molten solder onto the mold plate, the solder fill head also configured for relative movement over the mold plate; and a control mechanism configured for controlling positions of the solder fill head relative to the mold plate. The control mechanism includes: a control input signal containing data about an ideal positioning of the solder fill head; a plurality of sensors positioned on the solder fill head, the sensors configured for providing data about a gap between the solder fill head and the mold plate; a position controller configured for receiving the gap data and comparing the gap data with the control input signal, wherein the position controller provides an inequality signal if the gap data and the control input signal are not equal; an amplifier configured for receiving the inequality signal and amplifying it; and an actuator configured for receiving the amplified inequality signal and controlling movement of the solder fill head in response to the inequality signal received. The control mechanism may be a servo control mechanism. The sensors may be gap sensors.

C4NP servo controlled solder fill head

An air bearing gap control arrangement for injection molded solder filler heads. Also provided is a method of providing for a gap control for injection molded solder filler heads utilizing an air bearing arrangement. Provided is a C-ring seal, at the lower or dispensing region of the solder filler head structure, wherein the C-shape is open at the leading edge thereof. Hereby, a prevalent leading edge gap is tightly controlled by means of pressurized air in order to form an air bearing. Downstream of this leading edge is the molten solder, which is contained within a very narrow gap height between the solder filler head and the mold. As the solder fills the pits or recesses which are formed in the mold surface, air will rush out or be displaced from the pits towards the air bearing and is then expelled, while the deposited solder remains in place.

Growing community of inventors

Bedford Hills, NY, United States of America

Dennis G Manzer