Satcon Technology Corporation

Dennis E Hartzell

Gary M Colello

Edward J Ognibene

John Oleksy

Lyle Breaux

The present invention provides a heat exchange system for conducting heat away from high-power, heat-producing electronic components by conduction and convection. The heat exchange system comprises a metal tube that has been forged and drawn so as to define a flow channel for a cooling fluid, wherein the tube has an inner surface that comprises a plurality of integral fins that are structured and arranged to increase the available surface area of the inner surface of the metal tube exposed to the fluid and an outer surface that is in direct communication with the heat producing components. Coolant fluids are circulated through the flow channel, preferably, at turbulent flow conditions to minimize thermal resistance. The invention further provides a self-cooling, self-supporting electronic assembly that comprising one or more high-power electronic devices, the heat exchange systems, and an attaching system for attaching high-power electronic devices to the heat exchange system. The invention further provides a method of cooling a heat producing means comprising the steps of: providing a heat exchange system that is in direct communication with the heat-producing electronic components and circulating a fluid through the heat exchange system to conduct heat away from said heat exchange system and the heat producing electronic components.

Finned-tube heat exchangers and cold plates, self-cooling electronic component systems using same, and methods for cooling electronic components using same

A method for providing pre-placed, pre-brazed feed throughs in the substrate of a hermetic package corresponding to the terminal leads of the encased circuit COTS components. The substrate may include directly bonded copper (DBC) regions forming circular shapes where the holes for the special connectors of the present invention will be located. These holes will correspond to the leads of the COTS component that will be mounted to it. Holes are laser or mechanically drilled into the substrate inside the circular shapes formed in the DBC. To form the feed through, a bushing, such as a blind copper rivet, is brazed in the hole, with the open end thereof oriented toward the component-side of the substrate. These open ends can accept the leads of the COTS component, like the holes of a conventional PC circuit board.

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Hudson, MA, United States of America

Dennis E Hartzell