Koninklijke Philips Corporation N.v.

Other

Koninklijke Philips Electronics N.v.

Dennis Dean Clark

Ryan Manning

Barry Carl Scheirer

Jeffrey Scott Hart

Andrew Lee Robinson

Scott Owen Schweizer

Timothy Fred Nordgren

Haifeng Wang

John William Myers

Brian Moist

Daniel Agius

Barry Sheirer

An ultrasound imaging device includes a housing with an outer surface and an inner surface. The outer surface is grasped by a user. The device includes an array of acoustic elements transmitting ultrasound energy and receiving ultrasound echoes. The array is at an end of the housing. The device includes a heat sink within the housing and receiving heat generated by the array. The device includes a heat pipe within the housing and transmitting the heat away from the end of the housing. The device includes a heat spreader material on the inner surface of the housing and dissipating the heat. The distal portion of the heat pipe is in thermal contact with the heat sink and the proximal portion of the heat pipe is in thermal contact with the heat spreader material. The proximal portion and the distal portion have a flattened profile.

Heat dissipation in ultrasound probes

Systems, methods, and apparatuses for conducting heat from an ultrasound transducer and reducing drop impact forces are disclosed. A thermal management system including a thermally conductive compliant component in an ultrasound probe is disclosed. The thermal management system may include thermally conductive compliant component coupled to a transducer assembly. A printed circuit assembly (PCA) may be coupled to the compliant component. The thermally compliant component may conduct heat from the transducer assembly to the PCA. The PCA may be further coupled to a cable that may conduct heat from the PCA and away from the ultrasound probe.

Ultrasound probe with thermal and drop impact management

Ultrasound imaging systems are provided. An ultrasound system according to some embodiments includes a console configured to selectively communicate with a first ultrasound imaging device and a second ultrasound imaging device. The console includes a housing, a computing device disposed within the housing, and a connector receptacle assembly coupled to the housing. The connector receptacle assembly includes a first connector bank including a first plurality of electrical connections; and a second connector bank including a second plurality of electrical connections. The connector receptacle assembly is selectively matable to a first connector of the first ultrasound imaging device via only the first connector bank and to a second connector of the second ultrasound imaging device via the first and second connector banks.

Connectors for ultrasound imaging system

An ultrasound probe including an active thermal management system is disclosed. The active thermal management system may include a fluid chamber coupled to a transducer assembly of the ultrasound probe. The fluid chamber may include a coolant that may dissipate heat from the transducer assembly. The active thermal management system may further include a heat sink coupled to the fluid chamber and thermal management system. The heat sink may include fins that extend into the coolant. The coolant may be a liquid or a gas. The coolant may be circulated within the fluid chamber by a circulation device. The circulation device may be a pump, a fan, or an impeller. An ultrasound probe may further include a window that forms an enclosure over the lens of the transducer assembly. The enclosure may be fluidly coupled to the fluid chamber and filled with coolant to dissipate heat from the lens.

Systems, methods, and apparatuses for active thermal management of ultrasound transducers

A single element ultrasound transducer is fabricated from a laminate plate which produces multiple transducer elements simultaneously. The laminate plate includes the piezo ceramic, matching layer, and backing layer with rear electrode. The laminate plate is diced while mounted on nitto tape to retain the individual elements in position after dicing. The sides of the elements are covered with an insulating coating, which permits the transducer elements to be surface mounted on flex circuit by bonding the rear electrode to a signal conductor of the flex circuit and the matching layer to a return conductor by metallically coating the mounted transducer element and return conductor on the flex circuit.

High volume manufacture of single element ultrasound transducers

A curved high intensity focused ultrasound (HIFU) transducer comprising a curved piezoelectric array having opposite convex and concave surfaces, the concave surface being a transmitting surface, and a plurality of acoustic transmission areas, a plurality of electrodes located on the surfaces of the curved piezoelectric array for applying electrical transmit signals to the acoustic transmission areas, and a unitary, continuously formed curved matching layer pre-formed to the desired curvature of the curved transducer array and bonded to the transmitting surface of the curved piezoelectric array which provides acoustic matching and electrical isolation for the transmitting surface of the curved piezoelectric array.

Curved ultrasonic HIFU transducer with pre-formed spherical matching layer

An ultrasonic HIFU transducer () has a threaded opening into which a modular cavitation sensor () is removably located. The modular cavitation sensor includes a modular housing () containing a piezoelectric transducer for sensing acoustic signals indicative of cavitation. The modular cavitation sensor has electrodes () which engage spring contacts () in the threaded opening when the modular housing is screwed into the threaded opening. A damaged sensor can be unscrewed and replaced simply without connectors or soldering.

Spherical ultrasonic HIFU transducer with modular cavitation sense element

A curved high intensity focused ultrasound (HIFU) transducer comprising a plurality of curved composite ceramic piezoelectric tiles having opposite convex and concave surfaces, each tile having electrodes on the surfaces electrically coupled to the composite ceramic piezoelectric material, and a plurality of acoustic transmission areas located on each tile and actuated through electrodes on the convex surface, the transmission areas and electrodes being acoustically separated from surrounding areas by cuts into the composite ceramic piezoelectric material, the plurality of tiles fitting together to form a substantially continuous curved composite piezoelectric surface which transmits HIFU acoustic energy.

Curved ultrasonic HIFU transducer formed by tiled segments

A curved high intensity focused ultrasound (HIFU) transducer comprising a curved piezoelectric array having opposite concave front and convex back surfaces, and a plurality of acoustic transmission areas, a plurality of electrodes located on the convex back surface of the curved piezoelectric array for applying electrical transmit signals to the acoustic transmission areas, and a printed circuit board spaced apart from and in opposition to the back surface of the curved piezoelectric array which couples electrical signals to the acoustic transmission areas, the printed circuit board comprising a plurality of metal contacts which are compliant in the presence of thermal expansion and contraction and which span the space between the printed circuit board and the curved piezoelectric array and are electrically coupled to electrodes of the acoustic transmission areas of the curved piezoelectric array.

Curved ultrasonic HIFU transducer with compliant electrical connections

A curved high intensity focused ultrasound (HIFU) transducer comprising a curved piezoelectric array having opposite convex and concave back surfaces, the front surface comprising an acoustic transmitting surface, and a plurality of electrodes located on the convex back surface for applying electrical transmit signals to the array, and a printed circuit board spaced apart from and in opposition to the back surface of the curved piezoelectric array which couples electrical signals to the electrodes of the array, the space between the printed circuit board and the curved piezoelectric array comprising an acoustic air backing passageway of the piezoelectric array for air-cooling the curved piezoelectric array and the printed circuit board.

Curved ultrasonic HIFU transducer with air cooling passageway

An ultrasound probe includes a transducer array which is moved back and forth to sweep the image plane of the array through a volumetric region for 3D scanning. The transducer array is mounted on a carriage assembly which moves back and forth on a pair of rails inside a fluid compartment in the probe. The rails are preferentially arcuately curved to provide an elevationally divergent scan with a relatively wide aperture in the near field. A cam is provided for a motor-driven cable drive for the carriage assembly which provides relatively linear motion through the path of travel of the transducer array.

Three dimensional imaging ultrasound probe

Bench

A system for preventing rear end collisions is provided including a warning light housing with a transparent panel mounted to a rear of the vehicle. A distance detector is directed toward a rear of the vehicle. The distance detector is adapted to detect a distance from a following car. A bulb is provided for illuminating upon the actuation thereof. Finally, control circuitry is connected between the distance detector, bulb, a speedometer, and a battery of the vehicle. The control circuitry is adapted for receiving a speed of the vehicle from the speedometer and further to calculate a distance per speed value, whereby the control circuitry actuates the bulb only upon the distance per speed value being lower than a predetermined value.

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Lewistown, PA, United States of America

Dennis Dean Clark