Texas Instruments Corporation

Dennis D Davis

Buford H Carter, Jr

David R Kee

Richard E Johnson

Stephen R Nelson

Glen R Haas

Tammy J Lahutsky

John Walter Orcutt

Charles E Williams

Angus W Hightower

Charles W Suckling

Glenn Collinson

James W Pritchard

Jesse E Clark

John Barnett

Hai Tran

Steven P Laverde

An apparatus for forming a stamped groove in a lead frame including a tool for coining the groove in the lead frame. The tool has a shoulder to control swelling of the lead frame surface near the groove.

Lead frame tooling design for bleed barrier groove

A modular tool for forming features in an exposed pad having a pad surface between a bleed groove and an edge of the pad surface in a lead frame including a first tool for forming a bottom of the exposed pad under the pad surface, a second tool coupled to the first tool for forming a side of the exposed pad, and a third tool coupled to the first tool for forming another side of the exposed pad.

Lead frame tooling design for exposed pad features

A semiconductor device, especially a Ball Grid Array or Chip Scale Package, comprising an integrated circuit chip having at least one input/output terminal; a body of encapsulation material molded around said chip, forming a generally flat surface including at least one dimple having a suitable size and shape to receive a solder ball or solder paste; and said dimple having an electrically conductive solderable surface connected to said terminal.

Integrated circuit device with depressions for receiving solder balls and method of fabrication

A semiconductor device comprising a thermally conductive foil including a chip mount portion having first and second surfaces; an integrated circuit chip attached to said first surface; a body of encapsulation material molded around said chip and said first surface such that it leaves said second surface exposed; and said second surface comprising means for forming thermal contact, thereby creating a path for dissipating thermal energy from said chip. Said means for thermal contact comprise a configuration of said second surface suitable for direct thermal attachment to a heat sink. Alternatively, said means for thermal contact comprise a configuration of said second surface suitable for thermal attachment including solder balls between the chip and the heat sink.

Thermally enhanced semiconductor ball grid array device and method of fabrication

The invention provides a low inductance semiconductor package for RF circuits having a flat leadframe with internal leads formed upward to be in very close proximity to the die mount pad. The die mount pad is exposed through the package backside and serves both as a ground plane and as a heat spreader. The external leads are flat and extend beyond the package edge so that good solder connections to a printed wiring board can be made and inspected. The lead tips exposed beyond the package further provide a position for mold clamping and for test probing the device.

Low inductance power package for integrated circuits

This is a device package comprising: a leadframe comprising a plurality of leads for effecting circuit connections to the device; and a metal ground piece connected to the leadframe. Other devices and methods are also disclosed.

RF device package for high frequency applications

The invention is a single piece deep downset exposed lead frame (10) that can be used in current production processes. A single lead frame (10) has a die mount pad (12) that is formed with a downset or cavity into which the semiconductor die (20) is mounted. Wings (14, 15, 17, 18) lock the die pad in the device package (21) and increase the length of potential moisture paths (34a). The downset die pad (12) provides direct thermal contact of the die mount pad (12) to an external heat sink, eliminating the need for a heat slug internal to the package. The exposed die pad (12) can also be used as an RF ground connection to an RF circuit ground plane.

Downset exposed die mount pad leadframe and package

The invention is to a header for a power semiconductor device and a method for making the header. A ground pin is mounted or formed on the header mounting base and a header ground lead is placed over the ground pin and fused to the pin by a laser beam.

Laser bond header

A raised pedestal is formed on a leadframe die mount pad and is used in forming an electrical connection between the die bond pad and the semiconductor die, the electrical connection being isolated from the shear forces developed during temperature cycling or during thermal shock of the resultant semiconductor device. Such shear forces usually result in destruction of the bond between the semiconductor die and the die bond pad.

Leadframe with pedestal

This is a package [10] for an rf device [11] operable with a characteristic impedance providing a plurality of terminals [12-19] and [101] for effecting circuit connections to the device, the connection between at least one of the terminals and the device being matched in relation to the characteristic impedance. Other devices and methods are also disclosed.

Device packaging

A lead from 10 carries an integrated circuit on a die support pad 14. The lead frame has a dam bar including a transverse portion that extends between adjacent leads (20) for limiting mold flash. The dam bar transverse portion 26 is entirely severed from the adjacent leads for final removal by a metal punch 33 along with the supporting web 16.

Growing community of inventors

Garland, TX, United States of America

Dennis D Davis