International Business Machines Corporation

Dennis C Green

Stephen Edward Greco

Arnold Reisman

Frank Benjamin Kaufman

Melvin Berkenblit

A film forming, radiation sensitive resist composition having improved thermal stability and a reduced dissolution rate in developer solutions, comprised of a sensitizer and a polyalkenyl phenol such as a polyvinyl phenol cross-linked, prior to irradiation, with a poly-functional cross-linking agent such as dimethylol p-cresol or hexamethylene tetramine.

Cross-linked polyalkenyl phenol based photoresist compositions

Substituted derivatives of tetrathiafulvalene, tetraselenafulvalene and dithiadiselenafulvalene having the general formulae ##STR1## where Z is S and Y is S; Z is S and Y is Se; and Z is Se and Y is Se, and R can be CO.sub.2 H, R'R'COH, R'CHOH, COR', SCH.sub.3, SO.sub.2.sup.- Li.sup.+, SnR.sub.3 ', SiR.sub.3, --CH.sub.2 OH --CO.sub.2 R', R'CHOH, CHO, CR.sub.2 ' CR.sub.2 'OH, TTF, TSeF and DTDSeF, R' and R' can be the same or different and is selected from the group consisting of alkyls, aryls, alkaryls, ether substituted alkyls, halogen substituted alkyls and halogens, are prepared. A novel method for their preparation is also described.

Substituted heterofulvalenes

A method for controlling the etch rate of a quaternary etchant comprising ethylene diamine, water, pyrocatechol and a diazine. The etching rate is catalyzed and controlled by controlling the amount of the diazine present in the etchant. A method for the controlled etching of silicon is also disclosed.

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Hopewell Junction, NY, United States of America

Dennis C Green