Motorola Corporation

Other

Dennis Brian Miller

William M Beckenbaugh

Grace M O'Malley

Brian R Kemper

Cynthia M Melton

Daniel Joseph Viza

Michael S Lebby

Davis H Hartman

Kevin Douglas Moore

John W Stafford

Thomas H Blair

Kent W Hansen

Steven C Machuga

Kenneth Cholewczynski

Reed Allen George

Conrad S Monroe

Douglas Bruce Feicht

Ellen Margaret Reid

Mark William McGarry

A microelectronic assembly (,), such as a smart card, is formed by attaching a component subassembly (,) to a substrate (,). The substrate (,) includes a face (,) and defines a via (,) having a via opening (,) at the face (,). The substrate (,) further defines a component cavity (,) at the face (,) that is spaced apart from the via (,). An electrical element (,), such as a wound antenna, is disposed within the substrate (,) and includes a terminal (,) at the via (,). The component subassembly (,) is formed by mounting an integrated circuit component (,) onto a metallic lead (,). The integrated circuit component (,) is electrically connected to the metallic lead (,) by a wire lead (,). A protuberance (,) is connected to the metallic lead (,), preferably by forming a loop from a wire bond. A polymeric body (,) is formed about the component (,) and wire leads (,). The component subassembly (,) is superposed onto the substrate (,), and the component (,) is received in the component cavity (,). The metallic lead (,) is affixed to the face (,) and overlies the via opening (,). The protuberance (,) extends into the via (,) and contacts a conductive body (,) within the via (,). The conductive body (,) electrically connects the protuberance (,) and the terminal (,).

Microelectronic assembly with connection to a buried electrical element, and method for forming same

A microelectronic assembly (10), such as a smart card, is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26) that is spaced apart from the via (28). An electrical element (14), such as a wound antenna, is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A protuberance (20) is connected to the metallic lead (18), preferably by forming a loop from a wire bond. A polymeric body (56) is formed about the component (16) and wire leads (36). The component subassembly (34) is superposed onto the substrate (12), and the component (16) is received in the component cavity (32). The metallic lead (18) is affixed to the face (26) and overlies the via opening (30). The protuberance (20) extends into the via (28) and contacts a conductive body (22) within the via (28). The conductive body (22) electrically connects the protuberance (20) and the terminal (24).

Microelectronic assembly with connection to a buried electrical element,

A microelectronic assembly (10) is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26). An electrical element (14) is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A leg (20) is formed by deforming a portion of the metallic lead (18). A polymeric body (56) is formed about the component (16) and wire leads (36). The component subassembly (34) is superposed onto the substrate (12), and the component (16) is received in the component cavity (32). The metallic lead (18) is affixed to the face (26). The leg (20) extends into the via (28) and contacts a conductive body (22) within the via (28). The conductive body (22) electrically connects the leg (20) and the terminal (24).

Microelectronic assembly for connection to an embedded electrical

A microelectronic assembly (10) is formed by bonding an integrated circuit component (20) to a substrate (12). The substrate (12) includes a via (22) and a metal contact (24) closing the via (22). A bonding agent (14), such as a solder paste or a conductive epoxy, is dispensed into the via (22) adjacent the metal contact (24). A carrier tape (16) that includes partially-cured films (18) is placed onto the substrate (12) such that the film (18) covers the via (22) and forms a gap (28) between the substrate (12) and the film (18). The integrated circuit component (20) is superposed onto the substrate (12) such that conductive bumps (26) on the integrated circuit component (20) perforate and extend through the film (18) and contact the bonding agent (14) in the via (22). Portions (44) displaced during perforation are received in the gap (28). The film (18) is thus interposed between the substrate (12) and the integrated circuit component (20). The preassembly (38) is then heated to bond the bonding agent (14) to the metal contact (24) and to cure the film (18) to form an integral assembly (10).

Method for forming a microelectronic assembly

Solder paste (16) is dispensed onto a platen (12) that includes depressions (14) that are preferably conical or in an inverted pyramid shape. The solder paste (16) is formed of a plurality of particles composed of a solder alloy. Excess solder paste (16) is removed, and a predetermined solder paste volume fills the depressions (14). A substrate (18) is superposed onto platen (12) such that solder-wettable bond pads (20) on the substrate (18) register with the depressions (14). The platen (12) is heated to melt the solder alloy, and the solder alloy coalesces to form molten solder droplets (22). The solder droplets (22) are transferred onto the solder-wettable bond pads (20) to form solder bumps (24) bonded to the bond pads (20).

Method for forming solder bumps on bond pads

A vacuum pickup tool (10) is effective to carry balls (18) arranged in a desired pattern. The vacuum pickup tool (10) includes a manifold (12) that includes a carrier plate (22) that has a plurality of manifold bores (28) arranged in a pattern. The manifold (12) defines a vacuum chamber (20) that reduces gas pressure in the manifold (12) to allow the manifold bores (28) to retain a ball (18). The manifold (12) further includes a retaining plate (14) that overlies the carrier plate (22) and includes a plurality of retaining plate bores (30) arranged in a pattern such that each retaining plate bore (30) registers with a corresponding manifold bore (28). The retaining plate (14) is effective to secure a stencil (16) formed of a gas-impermeable sheet against the carrier plate (22) to prevent gas flow between a manifold bore (28) and a corresponding retaining plate bore (30).

Vacuum pickup tool for placing balls in a customized pattern

A solder paste of the type utilized in forming a solder onnectin for a microelectronic package comprises a mixture of compositionally distinct metal powders. The paste comprises a first metal powder formed of tin-bismuth solder alloy. The paste further comprises a second metal powder containing gold or silver. During reflow, the gold or silver alloys with the tin-bismuth solder to increase the melting part and enhance mechanical properties of the product connection.

Tin bismuth solder paste, and method using paste to form connection

A method for making a modular optical waveguide (100) including a plurality of optical modules (102, 103, 104, 105) with each optical module having at least a core region (101) that is surrounded by a cladding region (111, 112). A first groove 114 and a second groove 116 are disposed into cladding region (111, 112), thereby separating the optical modules (102, 103, 104, 105).

Modular optical waveguide and method for making

An improved method is provided for assembling an integrated circuit component to a substrate by a solder bump interconnection that is reinforced by a polymer film. The component is attached to a region of the substrate by a plurality of solder bump interconnections that create a gap between the component interface and the substrate region. A polymer dam is applied to the region encircling the attached component spaced apart therefrom. A liquid polymer precursor material is applied to the region including the gap and is confined by the dam to prevent indiscriminate flow across the substrate. In one aspect of this invention, gas is vented from the gap through a passage in the substrate to enhance fill by the precursor liquid. In another aspect of this invention, the precursor liquid is injected into the gap through a passage in the substrate and spread outwardly therefrom. In any event, the precursor liquid infiltrates the gap about the solder interconnections and is cured to form a film that reinforces and protectively encapsulates the solder interconnections.

Electrical component package comprising polymer-reinforced solder bump

A method of optimizing reproduction processes including the steps of preparing a physical standard, measuring the filtration and exposure values or densities used in preparing the standard, separating the image used in producing the standard into its color constituents using filtration values that are a function of those employed in making the standard, using a reproduction process to make many replicates of the standard, comparing representative samples of the replicate with the standard upon which the separations were based to measure the average difference in densities between the standard and such replicates, adjusting the filtration used in making the separations in response to such average differences until subsequent comparisons between subsequent standards yield average differences between acceptable, predetermined limits.

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Barrington, IL, United States of America

Dennis Brian Miller