Westinghouse Electric Corporation

Westinghouse Electric Company LLC

Denise B Harris

David B Harris

Robert A Bourdelaise

Lanson Y Shum

Andrew J Piloto

Brian H Smith

John A Olenick

John B Branthover

Dan B Zeitlin

Paul D Hodges, Jr

Theresa M Lengel

Victor J Brzozowski

Robert R Carlson, Jr

Both a system and a method are provided for electrically and mechanically connecting at least one integrated circuit die to a solderless printed wiring board of the type which uses connecting interfaces which include an array of resilient electrical connector means held within a sheet of compliant, insulating material. The system of the invention generally comprises a fanout interface formed from a sheet of insulating material integrally connected to the side of an integrated circuit die that includes the bond pads associated with such dies, wherein the fanout interface includes an internal array of contact pads that are connected to the bond pads of the die, and an external array of contact pads on its exterior surface which are advantageously spaced farther apart than the bond pads of the die. The system further comprises a connecting interface having an array of resilient electrical connectors disposed between the external surface of the fanout interface of the die, and an array of contact pads mounted directly on the printed wiring board. Finally, a screw-type heat conductive retainer is provided in order to compress the resilient electrical connectors of the connecting interface into conducting engagement between the contact pads on the fanout interface and the printed wiring board.

System for connecting integrated circuit dies to a printed wiring board

The invention is an improved chip carrier assembly utilizing a cavity-down chip carrier with a pad grid array wherein the IC chip within the chip carrier is mounted against a surface opposite the PWB to which the chip carrier is attached such that heat transfer from the IC chip may occur along a short path to a heat sink such that a large heat transfer rate is possible. Furthermore, the apparatus utilizes an alignment and electrical connection means between the contact pads of the chip carrier and a PWB to which the chip carrier is attached to compensate for shrinkage variation which occurs during the chip carrier fabrication process. Furthermore, within the cavity of the chip carrier there is space for additional components such as a decoupling capacitors. This permits the design of an apparatus providing better heat transfer properties, more accurate contact pad locations and the option of including within the chip carrier components which in the past had been mounted outside of the chip carrier.

Cavity-down chip carrier with pad grid array

A high performance, high current, miniaturized low voltage power supply is disclosed which employs a thick copper-ceramic film primary board, a direct bonded copper secondary, flexible printed circuit power inductors, the power supply has high power leadless chip carriers, hybrid rectifier packages and various electrical circuits including application specific integrated circuits for control, a turn on protection and current sharing.

High performance, high current miniaturized low voltage power supply

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Columbia, MD, United States of America

Denise B Harris