Schlumberger Systemes

Gemalto Sa

Denis Vere

Joseph Jerome Leibenguth

Yves Reignoux

Denis Groeninck

François Roussel

Severine Cheramy

Eric Daniel

Francois Roussel

Sophie Girard

Etienne Catte

Séverine Cheramy

A secured identification document has at least two flexible layers embedding an electronic module. The electronic module includes a flexible substrate on which are positioned an antenna and a radiofrequency microcontroller storing identification data. The radiofrequency microcontroller is electrically connected to said antenna. The secured identification document has the at least two flexible layers locally joined together by means of a chemically and mechanically tamper proof material that is applied in cavities that are distributed in each of said at least two flexible layers that surround the electronic module in order to make the electronic module interdependent with the at least two flexible layers.

Secured identification document

The invention involves a card, including a card body including at least three laminated plastic layers directly superimposed on each other, a second layer being a layer in polyethylene terephthalate glycol placed between a first layer and a third layer, the first layer and third layer being of a chemical nature different from that of said second layer, and an electronic module being incorporated in a cavity of the card body, the module including an integrated circuit, where the thickness of the second layer is of the same order of magnitude as that of the first and third layers, and wherein the cavity extends into the second layer from the first layer.

Manufacturing process for laminated cards with intermediate PETG layer

A method of making an electronic component, in particular a contactless card which includes an antenna. The card has an insulating substrate provided with conductive tracks, and a semiconductor chip mounted on the substrate. Conductive tracks are formed on the substrate by screen printing using a conductive ink. A semiconductor chip as provided with contact areas is supplied, and conductive terminals, or &ldquo;bumps&rdquo;, are formed on at least some of the contact areas. The chip is disposed on the substrate, before the conductive ink is dry, so that the ends of the bumps penetrate into the ink at the corresponding locations. The chip is fixed mechanically to the substrate by polymerizing an insulating adhesive resin disposed between the bottom face of the chip and the top face of the substrate.

Method of making an electronic component, and an electronic component

Growing community of inventors

Darvoy, France

Denis Vere