Blackberry Corporation

Research in Motion Corporation

Flir Unmanned Aerial Systems Ulc

Denis Lahaie

Arnett Ryan Weber

Todd Robert Paleczny

Sheldon Terry Schwandt

Beverley Howard Christian

Albert Murray Pegg

Glen Johannesson

Michael Peasgood

Beverley H Christian

A main body of an unmanned vehicle is provided. The main body comprises a propulsion-receiving module having a mount point for removably mounting a propulsion source, a payload-receiving module having a mount point for removably mounting a payload, and a damper interposed between the payload-receiving module and the propulsion-receiving module to inhibit transmission of vibrations from the propulsion-receiving module to the payload-receiving module when the payload-receiving module and the propulsion-receiving module are in mechanical communication.

Unmanned vehicle

A system and method is provided for detecting and measuring impacts in a wireless device. The wireless device has a processor coupled to a memory and an acoustic transducer. The method comprises acquiring data from the acoustic transducer, the data acquisition including the processor taking samples of an electrical input signal supplied to an input of the processor by the acoustic transducer; saving the acquired data in the memory; detecting whether an impact has occurred; and halting data acquisition after the impact is detected.

System and method for detecting and measuring impacts in handheld devices using an acoustic transducer

A method of measuring drop impact at an electronic device includes detecting a fall based on signals from drop detection sensor of the electronic device, receiving an output from a piezoelectric sensor in response to detecting the fall, and storing drop data based on the output from the piezoelectric sensor in a memory at the electronic device.

Portable electronic device and method of measuring drop impact at the portable electronic device

The described embodiments relate generally to methods and apparatus for use in determining solderability of an electrical component. One particular aspect relates to apparatus comprising a vacuum chamber, a load sensor, a platform and a control module. The load sensor has a contact portion disposed within the vacuum chamber and the platform is disposed in relation to the contact portion and has a component mounting surface and a mounting member for mounting an electrical component to the component mounting surface. The control module causes relative movement between the platform and the load sensor so that a contact surface of the electrical component is brought into close proximity with the contact portion. When the contact portion has solder thereon and the solder is brought into contact with the contact surface, the load sensor measures force arising from wetting of the solder to the contact surface. The force generated under contact changes over time, depending on the degree of solderability of the electrical component. Thus, measurement of the wetting forces over time provides an indication of the solderability of the electrical component.

Method and apparatus for testing solderability of electrical components

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Waterloo, Canada

Denis Lahaie