Additive Technologies LLC

Xerox Corporation

Rochester Institute of Technology

University of South Florida

Prisam LLC

Denis Cormier

Santokh Singh Badesha

Varun Sambhy

David Borkholder

Christopher T Chungbin

David Allen Mantell

Dinesh Krishna Kumar Jayabal

Daniel R Cormier

Ahmed Alfadhel

Manoj Meda

Chu-Heng Liu

Mark Edward Irving

Scott A Williams

Robert Dana Frisina

Joseph Paul Walton

Zachary S Vader

Viktor Sukhotskiy

Kareem N Tawil

Scott J Vader

Farzad Forouzandeh

Robert Nash Carter

David A Mantell

Pritam Poddar

Justin Kon

Xavier Tarr

Chaitanya G Mahajan

Jing Ouyang

Adam Foster

A method for operating a three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form vias in substrates. The method identifies the bulk metal being melted for ejection and uses this identification data to select the operational parameters. The method identifies the via holes in the substrate and operates an actuator to position an ejector opposite the via holes to eject drops of melted bulk metal toward the via holes to fill the via holes.

Method for operating a metal drop ejecting three-dimensional (3D) object printer to form vias in printed circuit boards with conductive metal

Material properties are manipulated using rapid pulse application of energy in combination with applied electric or magnetic fields. When sintering, annealing or crystallizing a target film, the pulse repetition cycle can be constrained to ensure material temperature rises above and falls below the Curie temperature before the next energy pulse. This process results in enhanced material properties as compared to traditional techniques having a single, slow temperature excursion and subsequent application of the applied external field.

Pulse energy manipulation of material properties

A three-dimensional (3D) object printer has an ejector head with a single nozzle that is fluidly connected to a plurality of orifices in an orifice plate of the ejector head. An ejection of material through the single nozzle is emitted through the plurality of orifices simultaneously. In one embodiment, some of the orifices are oriented at an angle to an axis perpendicular to the orifice plate. This configuration enables a structure to be formed with a predetermined material density without needing to increase the ejection frequency significantly or requiring the printer to incorporate multiple ejector heads.

Metal drop ejecting three-dimensional (3D) object printer having an increased material deposition rate

An apparatus for additive manufacturing having a body; a plurality of articulated arms, each having a jointed connection to the body opposite a free end, the plurality of articulated arms movable relative to each other and the plurality of articulated arms having opposable motions about the jointed connection; an extruder at the free end of each of the plurality of articulated arms, the extruder having an extruder nozzle extending from the free end; and at least one cooling nozzle extending from the free end of each of the plurality of articulated arms.

Extrusion system for additive manufacturing

A method of operating a three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form conductive metal traces on substrates with dimensions within appropriate tolerances and with sufficient conductive material to carry electrical currents without burning up or becoming too hot. The method identifies the material of the substrate and the bulk metal being melted for ejection and uses this identification data to select the operational parameters. Thus, the method can form conductive traces and circuits on a wide range of substrate materials including polymeric substrates, semiconductor materials, oxide layers on semiconductor materials, glass, and other crystalline materials.

Method for operating a metal drop ejecting three-dimensional (3D) object printer to form electrical circuits on substrates

A three-dimensional (3D) object printer has an ejector head with a single nozzle that is fluidly connected to a plurality of orifices in an orifice plate of the ejector head. An ejection of material through the single nozzle is emitted through the plurality of orifices simultaneously. In one embodiment, some of the orifices are oriented at an angle to a normal to the plane of the orifice plate. A splicer of the printer that generates machine ready instructions for operation of the printer identifies a standoff distance between the orifice plate and a surface onto which drops are being ejected to achieve a target drop spacing for the drops ejected onto the surface. In this manner, a material density for structure within a layer can be achieved without needing to increase the ejection frequency significantly or requiring the printer to incorporate multiple ejector heads.

A three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form vias in substrates. The apparatus identifies the bulk metal being melted for ejection and uses this identification data to select the operational parameters. The apparatus identifies the via holes in the substrate and positions an ejector opposite the via holes to eject drops of melted bulk metal toward the via holes to fill the via holes.

Metal drop ejecting three-dimensional (3D) object printer

A three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form conductive metal traces on substrates with dimensions within appropriate tolerances and with sufficient conductive material to carry electrical currents without burning up or becoming too hot. The apparatus identifies the material of the substrate and the bulk metal being melted for ejection and uses this identification data to select the operational parameters. Thus, the apparatus can form conductive traces and circuits on a wide range of substrate materials including polymeric substrates, semiconductor materials, oxide layers on semiconductor materials, glass, and other crystalline materials.

Method and system for operating a metal drop ejecting three-dimensional (3D) object printer to form electrical circuits on substrates

A method operates a three-dimensional (3D) metal object manufacturing system to compensate for errors that occur during object formation. In the method, thermal image data and dimensional image data of a metal object being formed by the 3D metal object manufacturing system is generated prior to completion of the metal object. Thermal conditions are identified from these data and compared to predetermined ranges corresponding to the identified thermal conditions to identify one or more errors. For identified errors outside a corresponding predetermined difference range, the method performs an error compensation technique. The error compensation includes modification of a surface data model, modification of machine-ready instructions, or operation of a subtractive device.

Method and system for operating a metal drop ejecting three-dimensional (3D) object printer to compensate for geometric variations that occur during an additive manufacturing process

An approach to printing a nickel precursor ink on a wide range of substrates for electronics and magnetic applications is disclosed. The nickel ink reduces to elemental nickel following heating. The ink was printed using an ultrasonic aerosol printing technique. By sintering the nickel precursor ink in the presence of a homogeneous magnetic field, the reduced nickel complex formed continuously aligned nickel nanofibers axially aligned with the direction of the magnetic field. The fabrication of aligned interlayered nanofiber films provides opportunities to produce structures with enhanced isotropic electrical and magnetic properties. The resistivity of the film was found to be as low as 0.56 m&#x3a9;&#xb7;cm, and the saturation magnetization was measured to be 30 emu/g, which is comparable to bulk Ni. Magnetic anisotropy was induced with an easy axis along the direction of the applied magnetic field with soft magnetic properties.

Magnetic field patterning of nickel nanofibers using precursor ink

In one embodiment, a peristaltic micropump comprising a substrate having a first side and a second side, a microtube that extends across the first side of the substrate, and multiple pump actuators formed on the first side of the substrate and positioned adjacent to the microtube at discrete, spaced positions along the length of the microtube, wherein the micropump is configured to sequentially actuate the pump actuators so as to create peristaltic action that drives fluid contained in the microtube along the length of the tube.

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Pittsford, NY, United States of America

Denis Cormier