Innolight Technology (suzhou) Ltd.

Innolight Technology Pte. Ltd.

Dengqun Yu

Yuzhou Sun

Long Chen

Zhenzhong Wang

Donghan Wang

Weilong Lee

Weilong Li

Xiangzhong Wang

Zhanwei Wang

Xigui Fang

Shuming Zhu

Yonggan Zhang

Jiang Chang

An optical module package structure, comprising a housing, and a circuit board, a first device, and a sub-board that are packaged in the housing. The housing comprises a first housing and a second housing. An outer surface of the first housing is a main heat-dissipation surface. The first device is electrically connected to the circuit board by means of the sub-board. A first signal line is provided on the circuit board. An extension section is provided on the sub-board. The sub-board partially overlaps the circuit board, and is connected to same. The first signal line extends to the extension section. The surfaces of the sub-board and the circuit board which partially overlap each other face opposite directions. The first device is electrically connected to the extension section. The first device is provided with a heat-dissipation surface. The heat-dissipation surface faces the first housing, and is thermally connected to same.

Optical module package structure

An optical component includes an active optical surface, a back surface opposite the active optical surface, and an installation surface connecting the active optical surface and the back surface. At least one of the active optical surface or the back surface is formed with a metal layer on at least a portion of an area located away from a center of the at least one of the active optical surface or the back surface.

Optical component, optical assembly, optical module, and manufacturing method thereof

An optical module includes: a housing, a heat sink arranged in the housing, a laser emitter arranged on the heat sink, a PCB partially arranged on the heat sink, and an optical system arranged in the housing. The optical module has an optical interface on one end and an electrical interface on the other end. The optical system is arranged between the laser emitter and the optical interface. The PCB is constructed as a rigid board. The laser emitter is electrically connected to the PCB. One end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface. The optical system transmits light emitted from the laser emitter to the optical interface.

Optical module

An optical module includes a housing, a heat sink apparatus arranged in and thermally connected to the housing, and a printed circuit board partially arranged on the heat sink apparatus. The optical module further includes an optoelectronic chip arranged on the heat sink apparatus. The printed circuit board has a first surface, a second surface opposite to the first surface, and an opening that extends from the first surface to the second surface. The heat sink apparatus is connected to the second surface. The opening is located near a center of the printed circuit board. The optoelectronic chip is arranged in the opening.

A receiver optical assembly includes: an optical platform, a receiver optical port and a wavelength division multiplexer being arranged along an optical path on the optical platform; a circuit board, a photodetector array being disposed on the circuit board; a mounting block, a focusing lens and an optical path shifter being disposed on t the mounting block, the mounting block being fixed on the circuit board, and the optical path shifter being placed above the photodetector array. Incident light containing a multi-channel optical signal enters through the receiver optical port, and the wavelength division multiplexer divides the incident light into a plurality of single-channel optical signal beams. The single-channel optical signal beams are coupled to photodetectors on the photodetector array after passing through the focusing lens and the optical path shifter on the mounting block.

Receiver optical assembly and assembly method thereof

An optical module includes a housing, a heat sink apparatus arranged in and thermally connected to the housing, and a printed circuit board partially arranged on the heat sink apparatus. The optical module further includes a first optoelectronic chip and a second optoelectronic chip that are both arranged on the heat sink apparatus. The first optoelectronic chip and second optoelectronic chip are both electrically connected to the printed circuit board. The printed circuit board has a first surface, a second surface opposite to the first surface, and an opening that extends from the first surface to the second surface. The second optoelectronic chip is arranged at the opening. The second optoelectronic chip is arranged separately from the first optoelectronic chip.

An optical assembly includes a carrier plate, a light emitting element and a lens component disposed on the carrier plate, and a securing block. The securing block has a first surface and a light-passing portion that are located on an optical path of an output light from the light emitting element. The lens component includes a lens portion and a connecting portion. The lens portion is located on the optical path. The connecting portion has a second surface facing the first surface of the securing block. A bottom surface of the securing block is bonded to the carrier plate. The lens component is secured onto the carrier plate by means of bonding between the second surface and the first surface of the securing block. A clearance space is present between the lens portion and the light-passing portion so that the lens portion does not contact the securing block.

Optical assembly

A circuit board includes an upper surface, a lower surface, a first end surface connecting the upper surface and lower surface, and a heat dissipation block. The first end surface of the circuit board has an open slot, the open slot extending through the upper surface and lower surface, and the heat dissipation block being arranged inside the open slot. The heat dissipation block has a first surface, the first surface facing away from the lower surface of the circuit board and extending to the first end surface of the circuit board. The inside of the open slot has a stop structure, the stop structure preventing the heat dissipation block from moving toward the first end surface of the circuit board.

Circuit board and optical module having such circuit board

Optical module including heat sink arranged in housing

An optical assembly is provided. The optical assembly includes a light transmitting terminal, a light receiving terminal, an optical component located between the light transmitting terminal and the light receiving terminal, a collimating unit located between the optical component and the light transmitting terminal, and a focusing unit located between the optical component and the light receiving terminal. The collimating unit includes a first lens located between the optical component and the light transmitting terminal, and a field lens located between the first lens and the optical component and configured to absorb an alignment error between the light transmitting terminal and the first lens. The focusing unit includes a second lens located between the optical component and the light receiving terminal.

Optical assembly and optical module

An optical path control system is provided. The optical path control system includes a converging lens used to converge a plurality of light beams passing through the converging lens, and an optical path assembly used to control propagation directions of the plurality of light beams passing through the optical path assembly. When the plurality of light beams pass through the optical path assembly and the converging lens sequentially, the optical path assembly converges the plurality of light beams, and the converging lens converges each of the plurality of light beam into a point of light.

Optical path control system and optical module

An optical module may include a case, an optical assembly, a circuit board interface positioned on the case, and a circuit board attached to the case through the circuit board interface. The optical assembly may be arranged in the case. The circuit board may include a first area that may electrically connect the circuit board to the optical assembly. The circuit board may also include a second area that may secure the circuit board to the circuit board interface. An optical module manufacturing method is also provided.

Growing community of inventors

Jiangsu, China

Dengqun Yu