Kla Tencor Corporation

Kla Corporation

Avago Technologies Ecbu IP (singapore) Pte. Ltd.

Dengpeng Chen

Yi Zhang

Daniel Ivanov Kavaldjiev

Andrew Zeng

Dieter Mueller

Chi Boon Ong

Alexander Buettner

Chee Heng Wong

Prasanna Dighe

Jie-Fei Zheng

Steve Zamek

Dong Chen

A system for analyzing a sample includes an illumination source with a plurality of transmitting optical fibers optically coupled to the illumination source and a detector with a plurality of receiving optical fibers optically coupled to the detector. The system further includes a plurality of probes coupled to respective ones of the plurality of transmitting optical fibers and respective ones of the plurality of receiving optical fibers. The plurality of probes are configured to illuminate respective portions of a surface of the sample and configured to receive illumination reflected, refracted, or radiated from the respective portions of the surface of the sample. The system may further include one or more switches and/or splitters configured to optically couple respective ones of the plurality of transmitting optical fibers to the illumination source and/or configured to optically couple respective ones of the plurality of receiving optical fibers to the detector.

Multi-spot analysis system with multiple optical probes

The system includes a dual interferometer sub-system configured to measure flatness across a substrate. The system includes a mass sensor configured to measure the mass of the substrate. The system includes a controller communicatively coupled to the dual interferometer sub-system and the mass sensor. The controller includes one or more processors. The one or more processors are configured to execute a set of program instructions stored in memory, the set of program instructions configured to cause the one or more processors to determine a thickness distribution of at least one of the substrate or a film deposited on the substrate as a function of position across the substrate based on one or more flatness measurements from the dual interferometer sub-system and one or more mass measurements from the mass sensor.

System and method for measuring substrate and film thickness distribution

The system includes a dual interferometer sub-system including a first and second channel. The system includes an illumination source. The illumination source includes a first laser source disposed along a first input path and a second laser source disposed along a second input path. The illumination sources includes a combiner-splitter element optically coupled to an output of the first laser source and an output of the second laser source and is configured to combine light of a first wavelength from the first laser source and light of a second wavelength from the second laser source. The combiner-splitter element is further configured to split the combined light into a first channel and a second channel of the dual interferometer sub-system, where the first and second each receive a portion of the light of the first wavelength and the light of the second wavelength.

Dual wavelength dual interferometer with combiner-splitter

A sensor for measuring the properties of light from a light source is disclosed. The sensor includes first and second photodetectors that are illuminated by the light. The first and second photodetectors generate first and second photodetector signals indicative of the first and second weighted averages of the intensity of light in a wavelength band between 400 nm and 700 nm. The first photodiode is more sensitive to light having wavelengths between 400 nm and 500 nm than the second photodetector. The sensor also includes a color temperature processing circuit that generates a first processed signal that is related to a ratio of the first and second signals. The color temperature processing circuit could include first and second logarithmic amplifiers that generate first and second logarithmic signals, respectively, from the first and second photodetector signals and a subtraction circuit that forms a signal indicative of the difference between the first and second logarithmic signals.

Integrated sensor for correlated color temperature and illuminance sensing

Growing community of inventors

Singapore, Singapore

Dengpeng Chen