Lexvu Opto Microelectronics Technology (Shanghai) Ltd

Shanghai Lexvu Opto Microelectronics Technology Co., Ltd.

Shanghai Jadic Optoelectronics Technology Co., Ltd

Deming Tang

Jianhong Mao

Lei Zhang

Fengqin Han

Zhiwei Wang

Cheng Yi Huang

A display device having a MEMS transmissive light valve and a method for forming the same are provided. The method includes: providing a multilayer semiconductor substrate comprising a bottom semiconductor layer, a middle buried layer and a top semiconductor layer; forming a light guide opening in the top semiconductor layer; forming at least one MOS device in a remaining part of the top semiconductor layer; forming an interconnection layer and an interlayer dielectric layer on the at least one MOS; forming a MEMS transmissive light valve, which is electrically connected to the interconnection layer, on the light guide opening, where the MEMS transmissive light valve is surrounded by the interlayer dielectric layer; forming a transparent backplane on a top surface of the interlayer dielectric layer; and removing the bottom semiconductor layer.

Display device having MEMS transmissive light valve and method for forming the same

A micro-electro-mechanical system based device for adjusting aperture and a manufacturing method thereof are disclosed. The system includes: an opaque deformable aperture ring, multiple groups of conductive deformable crossbeams and conductive structs; and one or more fixed parts. In each group, each conductive deformable crossbeam corresponds to a conductive struct. The conductive deformable crossbeams and the conductive structs are arranged around the deformable aperture ring and spaced from each other. The conductive deformable crossbeams are suspended in the air, their inner edges are connected with an external edge of the deformable aperture ring, and their external edges are connected with the fixed parts. The conductive structs are connected with the fixed parts and remain stationary. Electrostatic force between the conductive deformable crossbeam and the conductive struct causes the deformable aperture ring to be stretched and rotate, so that area of an inner bore of the deformable aperture ring is changed.

Micro-electro-mechanical system based device for adjusting aperture and manufacturing method thereof

A micro-electro-mechanical system based focusing device and manufacturing method thereof are disclosed. The system includes: a deformable lens, multiple groups of conductive deformable crossbeams and conductive structs; and one or more fixed parts. In each group, each conductive deformable crossbeam corresponds to a conductive struct. The conductive deformable crossbeams and the conductive structs are arranged around the deformable lens and spaced from each other. The conductive deformable crossbeams are suspended in the air, their inner edges are connected with an external edge of the deformable lens and their external edges are connected with the fixed parts. The conductive structs are fixedly connected with the fixed parts and remain stationary. Electrostatic force between the conductive deformable crossbeam and the conductive struct causes the deformable lens to be stretched and rotate, thus, surface curvature and focal length are changed. The device has a small size, low power consumption and low manufacturing cost.

Micro-electro-mechanical system based focusing device and manufacturing method thereof

A panel display device is provided, which includes: a transparent back panel having a first surface and a second surface, where the first surface is adapted for reflecting incident lights from the outside, and the second surface is adapted for transmitting lights from the outside; a backlight source, disposed at one side of the second surface of the transparent back panel, which is adapted for emitting lights to the transparent back panel; a polarized grating, disposed at one side of the first surface of the transparent back panel, which includes a plurality of grating strips with gaps formed between neighboring grating strips, where the polarized grating enables the incident lights from the transparent back panel to be polarized and then pass through the gaps; a semiconductor switch array; and a transmission light valve array. The panel display device of the disclosure increase the utilization efficiency of lights.

Panel display device

The present invention relates to a pressure sensor, which may include a first electrode plate, a second electrode plate, a third electrode plate, a fourth electrode plate and a fifth electrode plate, which are successively laminated on a substrate, wherein the first electrode plate, the third electrode plate and the fourth electrode plate are fixed to the substrate, the first electrode plate and the second electrode plate are disposed opposite to each other and have a gap formed therebetween, the second electrode plate is suspended over the first electrode plate to constitute a first capacitor; the second electrode plate and the third electrode plate are disposed opposite to each other and have a gap formed therebetween, to constitute a second capacitor; and the fifth electrode plate is suspended over the fourth electrode plate to constitute a third capacitor, and can move along a direction perpendicular to the substrate.

Pressure sensor, oscillator, ultrasonic wave sensor and measuring method thereof

A display device provided with an MEMS light valve, comprising: a substrate, a fixed grating located on the substrate, an MEMS light valve for controlling the opening and closing of the fixed grating; a guide is disposed on the substrate. The MEMS light valve comprises: a movable grating, a movable electrode and fixed electrodes; the moveable grating is located in the guide and is electrically connected to the guide when contacting the guide; one end of the movable electrode is fixedly connected with the movable grating, and the other end is suspended; and the fixed electrodes and the movable electrode form a capacitor. When a potential difference forms between the fixed electrodes and the movable electrode, the movable electrode drives the movable grating to move in the guide, thereby opening and closing the fixed grating. Therefore, the MEMS light valve sensitivity can be enhanced and reliability is improved.

Display device provided with MEMS light valve and forming method thereof

A projection display device includes a first display panel (), a second display panel (), a PBS (Polarization Beam Splitter) () with a first surface () and a second surface () opposite each other, a light recycling device (and), and a projection lens (). The PBS () transmits a first type parallel polarized light and reflects a second type parallel polarized light. The light recycling device (and) transforms the first type parallel polarized light transmitted by the PBS () into the second type parallel polarized light which carries a second image information, then reversely transmits the second type parallel polarized light to the second surface () of the PBS (). The projection display device improves the light utilization efficiency and can be used for 3D display.

Projection display device

A micro-electro-mechanical microphone and manufacturing method thereof are provided. The micro-electro-mechanical microphone includes a diaphragm, which is formed on a surface of one side of a semiconductor substrate, exposed to the outside surroundings, and can vibrate freely under the pressure generated by sound waves; an electrode plate with air holes, which is under the diaphragm; an isolation structure for fixing the diaphragm and the electrode plate; an air gap cavity between the diaphragm and the electrode plate, and a back cavity under the electrode plate and in the semiconductor substrate; and a second cavity formed on the surface of the same side of the semiconductor substrate and in an open manner The air gap cavity is connected with the back cavity through the air holes of the electrode plate The back cavity is connected with the second cavity through an air groove formed in the semiconductor substrate.

Method for manufacturing a micro-electro-mechanical microphone

A photosensitive imaging device and a method for forming a semiconductor device are provided. The method includes: providing a first device layer formed on a first substrate, wherein a conductive top bonding pad layer is formed on the first device layer; providing a continuous second device layer formed on a second substrate, wherein a continuous conductive adhesion layer is formed on the continuous second device layer; bonding the first device layer with the second device layer, where the top bonding pad layer on the first device layer is directly connected with the conductive continuous adhesion layer on the continuous second device layer; removing the second substrate; selectively etching the continuous second device and the continuous conductive adhesion layer to form a groove array; and filling up the groove array with an insulation material to form a plurality of second devices. Alignment accuracy may be improved.

Photosensitive imaging device and method for forming semiconductor device

A MEMS inertial sensor and a method for manufacturing the same are provided. The method includes: depositing a first carbon layer on a semiconductor substrate; patterning the first carbon layer to form a fixed anchor bolt, an inertial anchor bolt and a bottom sealing ring; forming a contact plug in the fixed anchor bolt and a contact plug in the inertial anchor bolt; forming a first fixed electrode, an inertial electrode and a connection electrode on the first carbon layer, where the first fixed electrode and the inertial electrode constitute a capacitor; forming a second carbon layer on the first fixed electrode and the inertial electrode; and forming a sealing cap layer on the second carbon layer and the top sealing ring. Under an inertial force, only the inertial electrode may move, the fixed electrode will almost not move or vibrate, which improves the accuracy of the MEMS inertial sensor.

MEMS inertial sensor and method for manufacturing the same

A method for manufacturing a micro-electro-mechanical system (MEMS) device is provided. The method comprises: providing a semiconductor substrate, the semiconductor substrate having a metal interconnection structure () formed therein; forming a first sacrificial layer () on the surface of the semiconductor substrate, the material of the first sacrificial layer is amorphous carbon; etching the first sacrificial layer to form a first recess (); covering and forming a first dielectric layer () on the surface of the first sacrificial layer; thinning the first dielectric layer by a chemical mechanical polishing (CMP) process, until exposing the first sacrificial layer; forming a micromechanical structure layer () on the surface of the first sacrificial layer and exposing the first sacrificial layer, wherein a part of the micromechanical structure layer is connected to the first dielectric layer. The method avoids polishing the amorphous carbon, shortens the period of production, and improves the production efficiency.

Method for manufacturing MEMS device

A display device provided with an MEMS light valve, comprising: a substrate, a fixed optical grating located on the substrate, an MEMS light valve for controlling the opening and closing of the fixed optical grating, the MEMS light valve comprises a first light valve and a second light valve; the opening and closing of the fixed optical grating is controlled via controlling the movement of the first light valve and the second light valve, and the moving directions of the first light valve and the second light valve are opposite. Also disclosed is a method for forming a display device provided with an MEMS light valve. Thus the sensitivity of the MEMS light valve is improved.

A low temperature wafer bonding method and a bonded structure are provided. The method includes: providing a first substrate having a plurality of metal pads and a first dielectric layer close to the metal pads, where the metal pads and the first dielectric layer are on a top surface of the first substrate; providing a second substrate having a plurality of semiconductor pads and a second dielectric layer close to the semiconductor pads, where the semiconductor pads and the second dielectric layer are on a top surface of the second substrate; disposing at least one of the metal pads in direct contact with at least one of the semiconductor pads, and disposing the first dielectric layer in direct contact with the second dielectric layer; and bonding the metal pads with the semiconductor pads, and bonding the first dielectric layer with the second dielectric layer.

Method for low temperature wafer bonding and bonded structure

A light modulator pixel unit and a method for manufacturing the same are provided. The light modulator pixel unit includes top, movable and bottom electrodes. Under control of a control circuit, the movable electrode may shift to first, second and third positions corresponding to modulations of first, second and third monochromatic lights, respectively. When the movable electrode is at a certain position, the incident light corresponding to the position may be divided into two parts, one is reflected by the top electrode, and the other one may bypass the top electrode and be reflected by the movable electrode. The two parts may interfere destructively. The light modulator pixel unit of the present invention can control monochromatic lights of three special wavelengths by time division, and enable color control and gray control. The unit is applicable in the field of projection display and panel system.

Light modulator pixel unit and manufacturing method thereof

A method for processing a thin film micro device on a substrate includes: 1) depositing a carbon film on the substrate as a sacrificial layer; 2) photolithographically defining a first predetermined pattern in the carbon film; 3) etching an unwanted portion of the carbon film outside the first predetermined pattern; 4) depositing a structural film including a single or multiple layers of solid state materials; 5) photolithographically defining a second predetermined pattern in the structural film; 6) etching the discarded portion of the structural film outside the second predetermined pattern; 7) selectively removing the remaining portion of the sacrificial carbon film by using a selective etch process gas in a reactor chamber, so that the overlapped portion of the remaining structural element with the first predetermined pattern is suspended above an underneath cavity above the substrate.

Growing community of inventors

Shanghai, China

Deming Tang