Asm Assembly Automation Limited

General Research Institute for Nonferrous Metals

Deming Liu

Ran Fu

Kui Kam Lam

Man Chung Raymond Ng

Chi Chuen Chaw

Yiu Fai Kwan

Jun Xu

Wai Tien Chan

Chou Kee Peter Liu

Wai Yuen Cheung

Zhao Gao

Ping Liang Tu

Hing Leung Li

Hing Suen Siu

Jianxiong Li

Ngai Kin Tsui

Jian Zhong Fan

Tao Zuo

A manufacturing process and apparatus therefore are provided for processing an electronic device comprising oxidizable material during processing. The electronic device is located inside a chamber and is heated a processing temperature with a heater. A reductive atmosphere is created in the chamber by supplying a gas comprising glycolic acid vapor while processing the electronic device at the processing temperature.

Manufacturing process and apparatus therefor utilizing reducing gas

A method of producing a leadframe is provided, the method including the steps of providing a substrate, plating the substrate with a layer of tin, plating a layer of nickel over the layer of tin, and thereafter plating one or more protective layers over the layer of nickel. The leadframe may thereafter be heated to produce one or more intermetallic layers comprising tin, which impedes the out-diffusion of copper from a base material of the leadframe to the surface thereof.

Leadframe comprising tin plating or an intermetallic layer formed therefrom

A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface. The bonding tip may further include martensite such that the titanium carbide is present in a hard phase and the martensite is present in a soft phase as a binder for the same.

Flip chip bonding tool

A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be performed by dipping, dripping or spraying the semiconductor device in or with a polymer solution.

Coating for enhancing adhesion of molding compound to semiconductor devices

A wire clamping plate is provided for a wire clamp that is adapted to contact a length of metallic wire when the wire clamp is applying a clamping force on the wire. The wire clamping plate comprises doped silicon carbide, which makes it electrically conductive and exhibit a high level of wear resistance.

Wire clamping plate

This invention concerns particulate reinforced Al-based composites, and the near net shape forming process of their components. The average size of the reinforced particle in the invented composites is 0.1&#x2013;3.5 &#x3bc;m and the volume percentage is 10&#x2013;40%, and a good interfacial bonding between the reinforced particulate and the matrix is formed with the reinforced particles uniformly distributed. The production method of its billet is to have the reinforced particles and Al-base alloy powder receive variable-speed high-energy ball-milling in the balling drum. Then, with addition of a liquid surfactant, the ball-mill proceeds to carry on ball-milling. After the ball-milling, the produced composite powder undergoes cold isostatic pressing and the subsequent vacuum sintering or vacuum hot-pressing to be shaped into a hot compressed billet, which in turn undergoes semisolid thixotropic forming and may be shaped into complex-shaped components. These components can be used in various fields. This product is featured with excellent property, good machinability, stable quality, component near net shape forming and cost effective and higher performance.

Particulate reinforced aluminum composites, their components and the near net shape forming process of the components

The invention provides an apparatus for die attachment onto a substrate including non-metallic material, and metallic material that is adapted to receive a die having a eutectic coating. A heating conduit is provided through which the substrate is movable for heating the metallic material to a eutectic bonding temperature to facilitate bonding between the die and the metallic material at a die-attach position. An induction heating device at the die-attach position heats the metallic material of the substrate to the eutectic bonding temperature prior to attaching a die onto the metallic material.

Growing community of inventors

Hong Kong, China

Deming Liu