International Business Machines Corporation

Demetrios Balderes

Joseph L Horvath

Lewis D Lipschutz

John R Kranik

Robert A Jarvela

Robert A Yacavonis

Herbert Lorenz Arndt, Jr

Andrew J Frankovsky

Charles John Lucas

John R Lynch

A direct module powering scheme is disclosed. A plurality of integrated circuit chips are mounted on a module. The module is mounted on a printed circuit board. A plurality of metallization layers are distributed in parallel fashion within the module. A voltage tab is mounted on the edge of the module substrate and in contact with the edge of the metallization layers. The voltage tab may be attached to a source of power for providing the necessary voltage and current to the module needed to power the chips mounted on the module. The metallization layers comprise voltage distribution layers and voltage reference (ground) layers. The voltage tab is connected to the edge of the voltage distribution layer. A plurality of plated vias are disposed through the module in contact with one or more of the metallization layers. A plurality of voltage distribution stripes are disposed on the bottom of the module substrate and in contact with the plated vias for providing the necessary voltage and current to remotely-located chips, relative to the voltage tab, needed to power the chips. The energizing current from the power source energizes the chips mounted on the module by way of the voltage tab, the voltage distribution layer, and a plated via. Alternatively, the energizing current from the power source energizes a remotely-located chip mounted on the module by way of the voltage tab, the voltage distribution layer, a plated via, a voltage distribution stripe, and another plated via connected to the remotely-located chip. As a result, the module is connected directly to the power source, rather than being connected to the power source by way of a plurality of power distribution planes disposed within the printed circuit board.

Apparatus for directly powering a multi-chip module from a power

A telescoping heat exchange element for conducting heat in a semiconductor package from a device to a spaced heat sink having a first cup-shaped member, a second cup-shaped member positioned in telescoping slidable relation with the first member, and a means to provide a firm sliding contact between the first and second members.

Telescoping thermal conduction element for semiconductor devices

A semiconductor device package having a substrate, one or more semiconductor devices mounted on the top surface of the substrate, a heat sink having a surface in opposed spaced parallel relation to the top surface of the substrate, and at least one deformable heat transfer member positioned between a device mounted on the top surface of the substrate, and the surface of the heat sink. The heat transfer member is comprised of a porous block of material, and a heat conductive non-volatile liquid retained within the block of material by a surface tension. The heat transfer member being operative to transfer heat from the device to the heat sink.

Semiconductor package with improved conduction cooling structure

Disclosed is ion implantation apparatus in which an ion source is coupled to a semiconductor or workpiece holder which is mounted for rotation and reciprocation in a first chamber in the path of the ion beam. A second chamber is releasably coupled to the first chamber with means connected to the second chamber in such a manner as to enable displacement between the first and second chamber, the chambers being in fluid communication with one another when the apparatus is in operation. Vacuum drawing means are provided to effect a vacuum in both the first and second chamber when the apparatus is in operation, and when it is desired to withdraw the holder from the apparatus by disconnecting the second chamber from the first chamber, venting the first chamber automatically actuates a check valve which seals the second chamber permitting the retention of a vacuum in the second chamber while allowing the first chamber to be exposed to atmospheric pressure.

Growing community of inventors

Wappingers Falls, NY, United States of America

Demetrios Balderes