Samsung Electro-mechanics Co., Ltd.

Ymt Co., Ltd.

Dek-Gin Yang

Young-Sang Cho

Young-Woo Kim

Kyu-Hyok Yim

Byoung-Ho Rhee

Keun-Ho Kim

Bum-Young Myoung

Eung-Suek Lee

Jong-Guk Kim

Won-Woo Cho

Dong-Kuk Kim

Sang-Won Ha

Kyoung-Up Shin

Ju-Hyung Kim

Jae-Suk Sung

Dong-Hwan Lee

Yang-Je Lee

Chan-Yeup Chung

Il-Kyoon Jeon

Yun-Seok Hwang

Jae-Youb Jung

Bong-Wan Koo

Young-Ho Lee

Hyung-Ho Kim

Steve Chun

II-Kyoon Jeon

A printed circuit board having a built-in antenna may include a first unit substrate, in which a ground and a first radiator are formed; a second unit substrate, which is stacked over the first unit substrate, and in which a second radiator having a frequency band different from a frequency band of the first radiator is formed; a pair of striplines, formed in the first unit substrate and connected with the ground; a first via, which connects the first radiator with the second radiator; a pair of second vias, each of which has one end connected with the pair of strip lines respectively; and a connection pattern, which connects the other ends of the pair of second vias to each other. The printed circuit board having a built-in antenna can utilize multiple frequency bands, and can be implemented in a compact size, to be applicable in compact communication devices.

Printed circuit board having built-in antenna

The present invention provides a composition for surface modification of a heat sink, the composition including: 0.01 to 10 parts by weight of an organic titanium compound; 0.01 to 5 parts by weight of an organic silane compound; 0.1 to 10 parts by weight of an organic acid; 0.01 to 5 parts by weight of a sequestering agent; and 0.1 to 10 parts by weight of a buffer with respect to 100 parts by weight of distilled water. The composition of the present invention provides excellent adhesion strength with prepreg, and improve heat releasing performance.

Composition for surface modification of a heat sink and method for surface treatment of the heat sink for printed circuit boards using the same

An electro-magnetic bandgap structure is disclosed. The electro-magnetic bandgap structure in accordance with an embodiment of the present invention includes a plurality of conductive plates bridge-connected with one another on a same plane, whereas the each of the conductive plates includes an internal patch; a first ring patch be electrically separated from the internal patch and surrounding the internal patch; and a second ring patch surrounding the first ring patch and electrically connected with the first ring patch through a portion.

Electro-magnetic bandgap structure

A printed circuit board and manufacturing method thereof. A printed circuit board has an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.

Method of manufacturing a circuit board

A printed circuit board and manufacturing method thereof are disclosed. A printed circuit board composed of an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.

Printed circuit board and manufacturing method thereof

Disclosed are a rigid-flexible PCB and a method for fabricating the rigid-flexible PCB. Characterized by using a liquid crystalline polymer for the formation of coverlay over flexible regions, the all-layer processing method has the advantage of preventing interlayer delamination, thereby providing a highly reliable rigid-flexible PCB which thus meets the recent requirements of electric appliances for low energy consumption, high frequency adoption, and slimness.

Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof

A method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the optical waveguide. The method includes pre-routing a portion of an adhesive meeting the optical waveguide to remove the portion, processing an adhesive weeping prevention layer so as to prevent the adhesive from blocking the optical signal entrance of the optical waveguide, arranging the optical waveguide, the adhesive, and the adhesive weeping prevention layer on a copper clad laminate, and combining the optical waveguide, a prepreg, and the adhesive weeping prevention layer with each other into a single structure. The adhesive weeping prevention layer is selected from the group consisting of a prepreg, a single-sided copper clad laminate, a thermally curable resin, a heat spreader, and an unclad.

Method of fabricating multi-layered printed circuit board for optical waveguides

Disclosed is a PCB in which a waveguide is embedded, and a method of producing the same. The PCB includes a substrate, and a lower clad layer formed on the substrate through a predetermined process to allow an optical signal irradiated thereto to be total-reflected thereby. A core layer is formed on the lower clad layer through a predetermined process and exposed using an exposing film on which a waveguide pattern is formed to form the waveguide with a predetermined shape therefrom. Furthermore, an upper clad layer is formed on the core layer through a predetermined process to allow the optical signal irradiated thereto to be total-reflected thereby.

Printed circuit board including waveguide and method of producing the same

Disclosed is an optical printed circuit board (PCB) for long-distance signal transmission, which is combined with fiber blocks and pipe blocks embedded in opto-via holes to form a multi-layered optical PCB, and transmits an optical signal using a fiber ribbon when an optical signal transmission distance between layers constituting the multi-layered optical PCB is longer than a length of an optical waveguide element used in conjunction with a silicon substrate. The optical PCB comprises a base substrate including an insulating material, a copper foil, and an opto-via hole, and an optical signal transmission member attached to the base substrate to horizontally transmit an optical signal. An optical signal connection member is horizontally connected to the optical signal transmission member to transmit the optical signal across a desired distance. Therefore, an optical PCB of the present invention is advantageous in that an optical waveguide, a pipe block, and a fiber block are horizontally and optionally arranged and attached to each other, thereby transmitting an optical signal across a longer distance than a length of a silicone substrate.

Optical printed circuit board for long-distance signal transmission

Disclosed herein are a brown oxide pretreatment composition for cleaning a copper surface and improving adhesion of a polyimide surface, and a method for improving adhesion of a polyimide surface by applying the composition to a brown oxide process. The brown oxide pretreatment composition for cleaning a copper surface and improving adhesion of a polyimide surface comprises, 5&#x2dc;15 g/L of an amine; 190&#x2dc;210 g/L of a hydroxide compound; at least one additive selected from 3&#x2dc;6 g/L of a cleaner adjuvant, 0.1&#x2dc;5 g/L of a antifoaming agent and 1&#x2dc;10 g/L of a precipitation inhibitor; and the balance of water. When the brown oxide pretreatment composition for cleaning a copper surface and improving adhesion of a polyimide surface is applied to a pretreatment step of a brown oxide process, it can clean a copper surface and improve adhesion of a polyimide surface.

Brown oxide pretreatment composition for cleaning copper surface and improving adhesion of polyimide surface, and method for improving adhesion of polyimide surface by applying the same to brown oxide process

Disclosed is a method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the optical waveguide. The method comprises pre-routing a portion of an adhesive meeting the optical waveguide to remove said portion, processing an adhesive weeping prevention layer so as to prevent the adhesive from blocking the optical signal entrance of the optical waveguide, arranging the optical waveguide, the adhesive, and the adhesive weeping prevention layer on a copper clad laminate, and combining the optical waveguide, a prepreg, and the adhesive weeping prevention layer with each other into a single structure. The adhesive weeping prevention layer is selected from the group consisting of a prepreg, a single-sided copper clad laminate, a thermally curable resin, a heat spreader, and an unclad.

Disclosed is a method of attaching an optical waveguide component to a printed circuit board, which is a double-sided or a multilayer printed circuit board, through pre-bonding and main-bonding by use of an adhesive tape. Prior to being attached to the printed circuit board, the optical waveguide component is preferably subjected to a plasma surface treatment to give a surface roughness thereto. The present method is advantageous in that the optical waveguide component can be attached to the printed circuit board with improved flatness and precise alignment without causing chemical or thermal damage to the optical waveguide component.

Growing community of inventors

Chungcheongbuk-do, South Korea

Dek-Gin Yang