Hysitron Incorporated

Exponential Business and Technologies Company

Dehua Yang

Thomas J Wyrobek

David J Vodnick

Richard J Nay

Ryan Farel

Methods and apparatuses for measurement of residual stresses are provided. For example, a method includes indenting a first portion of a sample having residual stress and generating a residual stress reference zone at a second portion of the sample. Indenting and generating a residual stress reference zone may be performed in situ (e.g., on the same instrument platform, etc.). The present disclosure also provides a method for generating a residual stress reference, the method including providing a first sample having a residual stress and reducing the residual stress in at least a portion of the sample, wherein reducing the residual stress includes raster scanning wear, or exposure to laser energy, ion beam energy, electron beam microscopy, scanning probe microscopy, scanning electron microscopy, heat energy, vibration energy; and exposing the sample to ultrasonic energy. An apparatus includes an indenter device structured and arranged to indent a first portion of a sample and a reference-generating device structured and arranged to generate a residual stress reference zone (e.g., in situ) in the sample.

Method and apparatus for residual stress measurement through indentation with in-situ generated reference

A tensile testing apparatus is provided, and generally includes an X-Y automated stage, and a first specimen holder for holding and transferring force to a specimen to a first portion of a specimen. The first specimen holder is operatively supported by the X-Y automated stage. A Z-automated stage, a multi-function nanotensile transducer head assembly, and a second specimen holder for holding and transferring force to a second portion of the specimen is further provided. The second specimen holder is operatively linked to the Z-automated stage via the nanotensile transducer head assembly. Variable displacement modalities, and non-Z alignment assessment and adjustment are enabled by the multi-function nanotensile transducer head assembly, as well as the X, Y, and Z automated stages.

Multi-scale & three-axis sensing tensile testing apparatus

A method for measuring toughness of interfacial adhesion including applying a normal force with a probe to a surface of a coating joined to a major surface of a substrate, wherein the surface is substantially parallel to the major surface, and applying a lateral force to the coating with the probe by laterally moving a position of the probe relative to the major surface such that the probe forms at least one delaminated region in the coating as the position of the probe moves laterally across the major surface, the delaminated region having a starting point and an ending point. The method further includes measuring a magnitude of the lateral force over time, and determining a toughness of interfacial adhesion between the coating and the major surface based on changes in magnitude of the lateral force as the position of the probe moves from the starting point to ending point.

Method of measuring properties of interfacial adhesion

A method for measuring toughness of interfacial adhesion including applying a normal force with a probe to a surface of a coating joined to a major surface of a substrate of an electronic structure, wherein the surface is substantially parallel to the major surface, and applying a lateral force to the coating with the probe by laterally moving a position of the probe relative to the major surface such that the probe forms at least one delaminated region in the coating as the position of the probe moves laterally across the major surface, the delaminated region having a starting point and an ending point. The method further includes measuring a magnitude of the lateral force over time, and determining a toughness of interfacial adhesion between the coating and the major surface based on changes in magnitude of the lateral force as the position of the probe moves from the starting point to ending point.

Method of measuring interfacial adhesion properties of electronic structures

A method for measuring toughness of interfacial adhesion including applying a normal force with a probe to a surface of a coating joined to a major surface of a substrate of a medical stent, wherein the surface is substantially parallel to the major surface, and applying a lateral force to the coating with the probe by laterally moving a position of the probe relative to the major surface such that the probe forms at least one delaminated region in the coating as the position of the probe moves laterally across the major surface, the delaminated region having a starting point and an ending point. The method further includes measuring a magnitude of the lateral force over time, and determining a toughness of interfacial adhesion between the coating and the major surface based on changes in magnitude of the lateral force as the position of the probe moves from the starting point to ending point.

Method of measuring interfacial adhesion properties of stents

A method for measuring toughness of interfacial adhesion including applying a normal force with a probe to a surface of a coating joined to a major surface of a substrate of a medical device, wherein the surface is substantially parallel to the major surface, and applying a lateral force to the coating with the probe by laterally moving a position of the probe relative to the major surface such that the probe forms at least one delaminated region in the coating as the position of the probe moves laterally across the major surface, the delaminated region having a starting point and an ending point. The method further includes measuring a magnitude of the lateral force over time, and determining a toughness of interfacial adhesion between the coating and the major surface based on changes in magnitude of the lateral force as the position of the probe moves from the starting point to ending point.

Method of measuring properties of interfacial adhesion of medical device coatings

A method for forming a topographical image of the heterogeneous variations in a surface of a material has a first machining step and a second scanning step. The preferred machining step uses a preselected scribing tool to scribe a plurality of adjacent grooves in a selected material surface at a preselected constant force. This machining step produces a machined surface whose local elevations relative to a datum plane are dependent on the local hardness or wear resistance of the surface. Then the scanning step shifts the scribing tool across the surface in contact with the surface, and measures the elevation of the tool at a plurality of selected surface coordinates. The measured elevations allow formation of a topological map depicting sub-micron structural features of the surface.

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Savage, MN, United States of America

Dehua Yang