Lam Research Corporation

Defu Liang

Steven T Mayer

Bryan L Buckalew

Thomas Anand Ponnuswamy

Lee Peng Chua

Jacob Kurtis Blickensderfer

Systems and methods are provided for method for etch assisted gold (Au) through silicon mask plating (EAG-TSM). An example method comprises providing a seed layer on a substrate and providing a silicon mask on at least a portion of the seed layer on the substrate. The silicon mask includes one or more via to be filled with Au. The masked substrate is subjected to at least one processing cycle, each processing cycle including an Au plating sub-step and an etch treatment sub-step. The cycles are repeated until a selected via fill thickness is achieved.

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Wilsonville, OR, United States of America

Defu Liang