Kulicke and Soffa Industries, Inc.

Kulicke and Soffa Investments, Inc.

Deepak Sood

Zhijie Wang

David T Beatson

Ivy Wei Qin

Joseph O DeAngelo

Paul W Sucro

Ray L Cathcart

Cuong Huynh

Thomas J Colosimo, Jr

Michael T Deley

Norman Lucas

Ashoke Banerjee

David A Rauth

Shu-Guo Tang

Peter M Lister

Wei Qin

E Walter Frasch

Ziauddin Ahmad

John David Molnar

Chunlong Hu

A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).

Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops

A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.

Systems and methods for measuring physical characteristics of semiconductor device elements using structured light

A method of applying bonding energy to form a bond between a portion of a wire and a contact of a bonding location using a wire bonding machine is provided. The method includes: (1) moving a bonding tool towards the contact; (2) detecting when a portion of the contact () is pressed against a device supporting surface () of the wire bonding machine; and (3) applying bonding energy to the portion of the contact such that a bond is formed between the contact and the portion of wire.

Closed loop wire bonding methods and bonding force calibration

A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Method of teaching eyepoints for wire bonding and related semiconductor processing operations

A system for determining wire bonding tool placement for use with a wire bonder and an optical imager is provided. The system includes a prism disposed below the optical imager and the wire bonding tool. The system also includes at least one lens positioned between the prism and a lower portion of the wire bonding tool along a first optical axis. The at least one lens and the prism define an object plane between the at least one lens and the lower portion of the wire bonding tool. The at least one lens is positioned between the prism and the optical imager along a second optical axis. The at least one lens and the prism define an image plane between the at least one lens and the optical imager.

Method and apparatus for mapping a position of a capillary tool tip using a prism

A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at least one lens positioned between the first image plane and the prism in a first optical path. The at least one lens is positioned between the prism and the imager in a second optical path, where the second optical path is different from the first optical path. An image of the free air ball disposed at a lower portion of the wire bonding tool is provided to the imager via the prism and the at least one lens.

Method and apparatus for measuring the size of free air balls on a wire bonder

A system and method for aligning optical fibers that takes into account variations due to temperature changes and other nonrandom systemic effects. The system includes an alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the first one of the pair of optical fibers, and an optical detector to receive an indirect image of a bottom surface of the first optical fiber through the alignment tool, such an offset between the first optical fiber and the optical detector is determined based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the first optical fiber, and receiving an indirect image of the first optical fiber through the cornercube offset tool.

Fiber alignment process using cornercube offset tool

Fiber alignment apparatus and process using cornercube offset tool

Growing community of inventors

New Britain, PA, United States of America

Deepak Sood