Littelfuse, Inc.

Deepak Nayar

Boris Golubovic

Martin G Pineda

Yuriy Borisovich Matus

Roel Retardo

Gordon Todd Dietsch

Marko Arciaga

A method for creating a dielectric thin-film coating for devices having a fusible element is disclosed. The method comprises mixing insoluble and soluble polymers in solid form and exposing the mixture to heat to create a melt mixture. The melt mixture is then dissolved in a solvent to create a slurry which can then be deposited on the device as a thin-film coating to create an interior insulation layer or an external surface.

Thin film coating packaging for device having meltable and wetting links

A surface mount device chip fuse including a dielectric substrate, electrically conductive first and second upper terminals disposed on a top surface of the dielectric substrate and defining a gap therebetween, a fusible element formed of solder disposed on the top surface of the dielectric substrate, within the gap, bridging the first and second upper terminals, and electrically conductive first and second lower terminals disposed on a bottom surface of the dielectric substrate and electrically connected to the first and second upper terminals, respectively, wherein a material of the dielectric substrate exhibits a de-wetting characteristic relative to the solder from which the fusible element is formed.

Surface mount fuse with solder link and de-wetting substrate

Growing community of inventors

Chicago, IL, United States of America

Deepak Nayar