Mcnc

International Business Machines Corporation

Northern Telecom Limited

Deepak Nayak

Arnold Reisman

Iwona Turlik

Giora Dishon

Scott L Jacobs

Neil M Poley

Lih-Tyng Hwang

Robert F Darveaux

A high performance integrated circuit chip package includes a support substrate having conductors extending from one face to the opposite face thereof and a multilayer wiring substrate on the opposite face of the support substrate for connecting chips mounted thereon to one another and to the conductors. A heat sink includes microchannels at one face thereof, with thermally conductive cushions connecting the one face of the heat sink with the exposed back sides of the chips, to provide a high density chip package with high heat dissipation. The support substrate and heat sink may be formed of blocks of material having thermal expansion matching silicon. The cushions are a low melting point solder, preferably pure indium, and are sufficiently thick to absorb thermal stresses, but sufficiently thin to efficiently conduct heat from the chips to the heat sink.

High performance integrated circuit chip package

A method and resulting structure is disclosed in which a metal-to-metal bond is formed by heating the surfaces to be bonded in an oxidizing ambient atmosphere until the desired bond is achieved. Heating takes place at 700.degree. C.-1200.degree. C. and bonding may be enhanced by applying pressure between the surfaces while heating.

Metal-to-metal bonding method and resulting structure

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Los Angeles, CA, United States of America

Deepak Nayak