Sensata Technologies, Inc.

Dedde Hedzer Wiersma

Frank Hendri Jacobs

Andrew F Willner

Albert Ferdinand Zwijze

Raymond E Mandeville

Andrew Legendre

Giovanni Fraone

Werner John Peter Kleissen

Shuo Robert Chen

Ernie Johannus Antonius Schoot Uiterkamp

Ted Medeiros

Matt Nelson

Edward Medeiros

Andrew Willlner

Matthew Nelson

A method of manufacturing a pressure sensor is shown, wherein the pressure sensor comprises a port element with a sealing structure and a membrane. Four strain gages will be attached to the membrane. The gages are used in a Wheatstone bridge to sense the fluid pressure. A first finite element action determines a first contour around the membrane central axis with equal compressive strain and a second contour around the membrane central axis with equal tensile strain wherein when fluid pressure is applied to the membrane strain on the first contour is opposite strain on the second contour. A second finite element action determines the four positions of the strain gages on the first and second contour such that the difference between the highest error signal and the lowest error signal at the output of the Wheatstone bridge is minimal under influence of parasitic forces.

Method of manufacturing a pressure sensor

Methods and apparatus for a microfused silicon strain gauge pressure sensor. A pressure sensor package includes a sense element configured to be exposed to a pressure environment, the sense element including at least one strain gauge, an electronics package disposed on a carrier and electrically coupled to the sense element, the carrier disposed on a port that includes the sense element, the port enabling a decoupling feature for sealing and parasitic sealing forces and a reduction of a port length, a housing disposed about the sense element and electronics package, and a connector joined to the housing and electrically connected to the electronics package, the connector including an external interface.

Microfused silicon strain gauge (MSG) pressure sensor package

In an embodiment, a stepped spring contact may have a first portion, a transition portion, and a second portion. The first portion may include a plurality of windings whose pitch may vary. The second portion may include a plurality of windings that are closely wound. A pitch of the windings contained in the second portion may be, for example, constant. The transition portion may include a winding that may make mechanical and electrical contact with a first electrical conductor (e.g., a pad contained on a printed circuit board (PCB)). The first portion may include a tip. The tip may be, for example, flat shaped or conically shaped. The tip may make electrical contact with a second electrical conductor (e.g., a terminal connector). In operation, the stepped spring contact may provide electrical continuity between the first electrical conductor and the second electrical conductor.

Stepped spring contact

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Deventer, Netherlands

Dedde Hedzer Wiersma