Quantum Materials Corporation

Deborah L Derfelt

Stephen M Dershem

Dennis B Patterson

Bleed resistant cyanate ester-containing compositions

In accordance with the present invention, there are provided adhesive formulations containing small amounts of bleed control agent, which render the invention compositions extremely resistant to resin bleed. Several different types of bleed control agents are contemplated for use in the practice of the present invention, e.g., cationic surfactants, tertiary amines, tertiary phosphines, amphoteric surfactants, polyfunctional compounds, and the like, as well as mixtures of any two or more thereof.

In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid polycyanate ester monomer, electrically conductive filler, and a curing catalyst, in the substantial absence of alkylphenol. The recognition that attach paste compositions are effective without the addition of alkylphenol has the benefit of reducing the cost of preparation, as well as the ease of preparation of die attach pastes containing electrically conductive filler and polycyanate ester monomer. The incorporation of alkylphenol into die-attach paste compositions has been found to be unnecessary, due to the presence of catalytically active species on the surface of filler flake employed in the preparation of such pastes. Indeed, it is desirable to eliminate alkylphenols from die-attach paste compositions because alkylphenols are acidic species that do not become incorporated into the final polymerized matrix of the cured attach paste. These acidic species can thus leach out, leaving voids in the cured composition and causing corrosion of sensitive electronic parts which come in contact therewith. Optional treatment of filler to render it free of catalytically active metal ions significantly extends the pot life of the composition.

Solvent free die-attach compositions

In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid polycyanate ester monomer, electrically conductive filler rendered substantially free of catalytically active metal ions and a curing catalyst. Treatment of filler to render it free of catalytically active metal ions significantly extends the pot life of the composition.

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San Diego, CA, United States of America

Deborah L Derfelt