Henkel Corporation

Quantum Materials Corporation

Deborah Derfelt Forray

Puwei Liu

Benedicto Delos Santos

Stephen M Dershem

Benedicto P Delos Santos

The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

B-stageable die attach adhesives

The invention is based on the discovery that certain self-filleting die attach adhesives are useful in semiconductor die assemblies containing thin die. As used herein, the term 'self-filleting' refers to any adhesive that when dispensed and then subjected to suitable cure conditions, will flow and fill up the area between two die or between a die and a substrate while not forming a bulky fillet that can overflow onto the top of the die. In addition, the invention is useful for tight tolerance semiconductor die assemblies, since the fillet from the die-attach adhesives employed in the methods of the invention does not cover bond fingers, thereby causing wire bond yield loss.

Methods for assembling thin semiconductor die

In accordance with the present invention, it has been discovered that perfluorinated hydrocarbon polymers can be used as fillers for the preparation of adhesive formulations having excellent dielectric properties, i.e., very low conductivities. Invention compositions display excellent rheological properties, in addition to low dielectric constants. Invention formulations can be used for a variety of purposes, such as, for example, for the preparation of filled adhesive formulations with a reduced propensity to settle out, excellent dispensing characteristics due to the thixotropic nature thereof, and the like.

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San Diego, CA, United States of America

Deborah Derfelt Forray