International Business Machines Corporation

Deborah Anne Sylvester

Evan G Colgan

Benjamin V Fasano

Jeffrey Allen Zitz

Sushumna Iruvanti

Gary Franklin Goth

Daniel D Reinhardt

Rehan Choudhary

James N Humenik

Rao Venkateswara Vallabhaneni

Jawahar P Nayak

Renee L Weisman

Michael E Cropp

James C Utter

Gerald H Leino

John A Trumpetto

Frank V Ranalli

James M Blazick

The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to apparatus and methods for thermally coupling semiconductor chips to a heat conducting device (e.g., copper thermal hat or lid) using a compliant thermally conductive material (e.g., thermal paste), wherein a thermal interface is designed to prevent/inhibit the formation of voids in the compliant thermally conductive material due to the flow of such material in and out from between the chips and the heat conducting device due to thermal cycling.

Apparatus and methods for cooling semiconductor integrated circuit package structures

A method and device comprising an easily reworkable alpha particle barrier is provided. The easily reworkable alpha particle barrier is applied in the space between the surface of the chip and the surface of the substrate, and reduces soft error rate (SER). Further, the easily reworkable alpha particle barrier material is chosen from the group of an organic material, a hydrocarbon, more specifically a polyalphaolefin (PAO) oil, and a polymer or filled polymer; wherein the polyalphaolefin oil has a viscosity below 1000 cSt (at 100&#xb0; C.). The easily reworkable alpha particle barrier material can be used with multichip modules (MCM's) allowing easy device rework of one or more dies without affecting other dies on the same substrate.

Method and device including reworkable alpha particle barrier and corrosion barrier

A process of forming a multi-layer feature on a ceramic or organic article in which first and second layers of paste are sequentially screened through a screening mask wherein the screening mask has not been moved between screening steps. A structure produced by this process is also disclosed.

Single mask screening process

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Poughkeepsie, NY, United States of America

Deborah Anne Sylvester