Honeywell G.m.b.h.

Deborah A Cullinan

Thomas J Dunaway

Richard K Spielberger

Method for testing bare semiconductor die which includes providing a test substrate with a die receiving surface and bond pads with conductive traces which extend away from the surface and are connected to leads that may be contacted with test probes. A vacuum source is applied to an aperture in the die receiving surface. Atmospheric pressure holds the die in place during the connection of thin wires. After connection, the die is held in place during testing by the thin wires.

Vacuum die bond for known good die assembly

A method of making a temporary connection to an unpackaged semiconductor die, removing the temporary connection and preparing the site of the temporary connection to receive a permanent connection.

Method for providing a test connection and a permanent connection site

A semiconductor package including a base having a chip receiving portion and a surrounding portion; a bridge having conductive strips extending over the chip and supported at the surrounding portion; wires connect the conductive strips to power and ground; and wires connect the conductive strips to chip area power and ground bonding pads. Decoupling capacitors may be mounted on the base.

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Plymouth, MN, United States of America

Deborah A Cullinan