Fujitsu Corporation

Debasis Dawn

Yoji Ohashi

Toshihiro Shimura

Edmar Camargo

A millimeter wave system includes a plurality of millimeter wave modules, each of which comprises a substrate; a microstrip conductor formed on one surface side of the substrate; a ground plate formed on the other surface side of the substrate; and conductive pads which are disposed on both sides of a strip conductor portion which extends from said microstrip conductor via a tapered portion, and which are connected to the ground potential of said ground plate through a via hole, wherein the strip conductors of this plurality of millimeter wave modules are connected to each other using conductive ribbon. Moreover, when a plurality of millimeter wave modules is connected to form a millimeter wave system, the effect produced by the interaction between the unnecessary conductive pads connected to the ground potential and the strip conductor can be reduced.

Millimeter wave module having probe pad structure and millimeter wave system using plurality of millimeter wave modules

Disclosed are planar structures for coupling electromagnetic signals between planar transmission lines and waveguides. A preferred exemplary structure comprises a shielded patch antenna and one or more capacitive diaphragms disposed adjacent to the patch antenna. This structure is advantageous to MMIC modules in connecting from a planar transmission line of a substrate carrying an MMIC to an external waveguide without the need of a non-planar back metal short, which is normally essential to avoid back scattering from the waveguide and also normally needed to achieve impedance matching. In structures according to the present invention, a patch antenna radiates into the waveguide while the antenna's ground plane reduces back scattering from the waveguide. The one or more capacitive diaphragms provide impedance matching between the microstrip and the waveguide.

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Yamanashi, Japan

Debasis Dawn