Amkor Technology, Inc.

Unitive International Limited

Amkor Technology Singapore Holding Pte. Ltd.

Dean Zehnder

Glenn A Rinne

Robert Lanzone

Devarajan Balaraman

Greg Hames

Daniel Richter

Sundeep Nand Nangalia

Richard Raymond Green

J Daniels Mis

Christopher J Berry

Ludovico Estrada Bancod

Riki Whiting

An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.

Electronic device with top side pin array and manufacturing method thereof

Methods for copper pillar protection may include forming a metal post over a contact on a semiconductor die, where the metal post comprises a sidewall. A metal cap may be formed on the metal post and may be wider than the width of the metal post. A solder bump may be formed on the metal cap, and a conformal passivation layer may be formed on at least the sidewall of the metal post. The metal cap may be rounded shaped or rectangular shaped in cross-section. The metal post and the metal cap may comprise copper. The metal cap may comprise a copper layer and a nickel layer. The seed metal layer may comprise one or more of titanium, tungsten, and copper. The conformal passivation layer may comprise a nonwettable polymer. Horizontal portions of the conformal passivation layer may be removed utilizing an anisotropic etch such as a plasma etch.

Copper pillar sidewall protection

An electronic component structure includes a primary redistribution structure having a primary redistribution structure terminal. A secondary redistribution structure is formed on the primary redistribution structure terminal. A buildup dielectric layer encloses the primary redistribution structure, where a cushion pad of the secondary redistribution structure is supported by the buildup dielectric layer. An interconnection ball is mounted to the secondary redistribution structure. Stress imparted upon the interconnection ball is transferred through the secondary redistribution structure and dissipated to the buildup dielectric layer through the cushion pad. The buildup dielectric layer is readily able to absorb this stress thus minimizing the probability of failure of the secondary redistribution structure including the interconnection ball formed thereon.

Electronic component package fabrication method and structure

A method includes forming a first buildup dielectric layer on a wafer. The wafer includes electronic components delineated from one another by singulation streets. A singulation street exposure light trap layer is formed on the singulation streets. A second buildup dielectric layer is applied and patterned by being selectively exposed to an exposure light. The singulation street exposure light trap layer traps and diffuses the exposure light thus preventing the exposure light from being reflected to the portion of the second buildup dielectric layer above the singulation streets. In this manner, complete removal of the second buildup dielectric layer above the singulation streets is insured.

Electronic component package fabrication method

Methods may be provided for forming an electronic device including a substrate, a conductive pad on the substrate, and an insulating layer on the substrate wherein the insulating layer has a via hole therein exposing a portion of the conductive pad. In particular, a conductive structure may be formed on the insulating layer and on the exposed portion of the conductive pad. The conductive structure may include a base layer of titanium-tungsten (TiW) and a conduction layer of at least one of aluminum and/or copper. Moreover, the base layer of the conductive structure may be between the conduction layer and the insulating layer. Related devices are also discussed.

Conductive structures including titanium-tungsten base layers

Methods of forming conductive structures including titanium-tungsten base layers and related structures

Growing community of inventors

Hillsborough, NC, United States of America

Dean Zehnder