Cutting Edge Optronics, Inc.

Dean W Micke

Alan D Boxell

Dana A Marshall

Edward Franklin Stephens, Iv

Edward F Stephens

James T Tracey

A laser diode assembly includes a laser diode having an emitting surface and a reflective surface opposing the emitting surface. Between the emitting and reflective surfaces, the laser diode has first and second surfaces to which a first heat sink and second heat sink are attached, respectively, via a solder bond. A spacer element is disposed between the first and second heat sinks and is below the laser diode. The spacer element has a width that is chosen to provide optimum spacing between the first and second heat sinks. The spacer element has a height that is chosen to place the emitting surface of the laser diodes at a position that is substantially flush with the upper surfaces of the heat sinks. A substrate is positioned below the first and second heat sinks and is attached to these two components usually via a solder bond. The substrate is preferably of a nonconductive material so that electrical current flows only through the heat sinks and the laser diode. To properly locate the spacer element, the substrate may include a locating channel into which the spacer element fits. Each of the heat sinks is coated with a solder layer prior to assembly. Once the components are placed in their basic assembly position, only one heating step is needed to cause the solder layer on the heat sinks to reflow and attach each heat sink to the adjacent laser diodes and also to the substrate.

Laser diode package with heat sink

A solid-state laser system for producing high output power and which is packaged in a small, cylindrical housing is set forth. The system includes a plurality of optical energy sources which emit energy that is absorbed by a solid-state laser medium that is configured as a rod. The solid-state laser medium has a central axis, first and second end surfaces, and outer surface between the end surfaces upon which the energy emitted from the optical energy sources is incident. The energy power sources are typically semiconductor laser diode arrays. The laser diode arrays are positioned adjacent to the cylindrical outer surface of the laser medium and usually extend along a substantial portion of the entire length of the outer surface. The system also includes first and second mirrors which are substantially aligned with the central axis of the laser medium for producing laser resonation through the first and second end surfaces of the laser medium. Because of the waste heat produced by the laser medium and the laser diode arrays, the laser system contains a manifold system for circulating a fluid past these components. The cylindrical housing has a diameter that is preferably less than about 2.0 inches and is mechanically coupled to the optics bench. The cylindrical housing is the same size as the housings used in other low-power laser systems so that the same mounting structures which are commonly used to support these other common lasers can be used to support this high-power, solid-state laser system.

High-power, solid-state laser in a cylindrical package

Laser diode packaging

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Marthasville, MO, United States of America

Dean W Micke