Credence Systems Corporation

Kla Tencor Corporation

Onwafer Technologies, Inc.

Dean Hunt

Mason L Freed

Don Haga

Michael D Welch

Randall S Mundt

Costas J Spanos

Paul Douglas MacDonald

Andrew Beers

Kameshwar Poolla

One or more problems related to processing workpieces using processes that involve optical radiation are presented along with solutions to one or more of the problems. One embodiment of the invention comprises a sensor apparatus for collecting optical radiation data representing one or more process conditions used for processing a workpiece. In a further embodiment, the sensor apparatus is also configured for measuring data other than optical radiation.

Apparatuses for and methods of monitoring optical radiation parameters for substrate processing operations

This invention seeks to provide methods and apparatus that can improve the accuracy of measured parameter data used for processing workpieces. One aspect of the present invention includes methods of measuring process conditions with low distortion of the measurements caused by the measuring apparatus. The measurements include data for applications such as data for monitoring, controlling, and optimizing processes and process tools. Another aspect of the present invention includes apparatus for measuring substantially correct data for applications such as generating data for monitoring, controlling, and optimizing processes and process tools.

Methods and apparatus for low distortion parameter measurements

Method and apparatus for optically testing (e.g., using a laser beam) an operating integrated circuit (device under test&#x2014;DUT) that actively control the operating temperature of the DUT. This is chiefly useful with flip-chip packaged ICs. The temperature of the DUT varies with its operating power consumption, and this fluctuation in temperature adversely affects the results obtained during optical probing or other optical testing. Furthermore, the DUT may be damaged if its temperature exceeds design limits. The temperature of the DUT is controlled by thermally contacting the exposed backside surface of the DUT die to a diamond film heat conductor, an associated heat sink structure, and at least one thermoelectric device. The thermoelectric device is controlled by a temperature sensor proximal to the DUT. By controlling the amount and direction of the electrical current supplied to the thermoelectric device in response to the sensed temperature, the temperature of the DUT is maintained.

Optical testing of integrated circuits with temperature control

Method and apparatus for optically testing (e.g., using a laser beam) an operating integrated circuit (device under test&mdash;DUT) that actively control the operating temperature of the DUT. This is chiefly useful with flip-chip packaged ICs. The temperature of the DUT varies with its operating power consumption, and this fluctuation in temperature adversely affects the results obtained during optical probing or other optical testing. Furthermore, the DUT may be damaged if its temperature exceeds design limits. The temperature of the DUT is controlled by thermally contacting the exposed backside surface of the DUT die to a diamond film heat conductor, an associated heat sink structure, and at least one thermoelectric device. The thermoelectric device is controlled by a temperature sensor proximal to the DUT. By controlling the amount and direction of the electrical current supplied to the thermoelectric device in response to the sensed temperature, the temperature of the DUT is maintained.

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Danville, CA, United States of America

Dean Hunt