Apple Inc.

Duke University

Dean F Darnell

Robert W Schlub

Mattia Pascolini

Yuehui Ouyang

Matthew A Mow

Hongfei Hu

Nanbo Jin

Enrique Ayala Vazquez

Ming-Ju Tsai

Scott A Myers

Robert J Hill

Liang Han

Nicholas G L Merz

Ruben Caballero

Hao Xu

Yijun Zhou

David W Pratt

Thomas E Biedka

Joshua G Nickel

William Jean Noellert

Allen W Song

Trong-Kha Truong

Zhijun Zhang

Teodor Dabov

Jayesh Nath

Erica J Tong

Peter I Bevelacqua

Hui Leng Lim

Daniel William Jarvis

Qingxiang Li

Edward Siahaan

Joseph Hakim

Xu Han

Anand Lakshmanan

Rocco V Dragone, Jr

Nirali Shah

Peter Bevelacqua

Nicholas GL Merz

Enrique Ayala Vasquez

RF coil array assemblies include an RF coil array with a plurality of coil elements. The coil elements each have an RF conductor that defines an RF path. The coil elements operate in an RF mode for at least one of transmitting RF excitation signals or receiving MRI image signals on the RF conductors. The RF coil array assemblies also include at least one wireless module connected to the RF coil array, the at least one wireless module including a wireless transceiver operative at a wireless communication frequency band and attached to at least some of the coil elements to provide input and output signals to the at least one wireless module. At least some of the coil elements can concurrently transmit or receive wireless communication data and the RF excitation signals or the received MRI image signals.

MRI RF coil assemblies with RF coil elements that allow wireless communication data transmission and related methods and systems

Systems, methods and devices are configured for integrated parallel reception, excitation, and shimming (iPRES) with RF coil elements with split DC loops. Parallel transmit/receive (which can include Bshimming and/or parallel imaging capabilities) and Bshimming employ the same set of localized coils or transverse electromagnetic (TEM) coil elements, with each coil or TEM element working in both an RF mode (for transmit/receive and Bshimming) and a direct current (DC) mode (for Bshimming) simultaneously. Both an RF and a DC current (in split DC loops) can flow in the same coil element simultaneously but independently with no electromagnetic interference between the two modes.

RF coil elements with split DC loops for magnetic resonance imaging systems for integrated parallel reception, excitation, and shimming and related methods and devices

An electronic device may be provided with shared antenna structures that can be used to form both a near-field-communications antenna such as a loop antenna and a non-near-field communications antenna such as an inverted-F antenna. The antenna structures may include conductive structures such as metal traces on printed circuits or other dielectric substrates, internal metal housing structures, or other conductive electronic device housing structures. A main resonating element arm may be separated from an antenna ground by an opening. A non-near-field communications antenna return path and antenna feed path may span the opening. A balun may have first and second electromagnetically coupled inductors. The second inductor may have terminals coupled across differential signal terminals in a near-field communications transceiver. The first inductor may form part of the near-field communications loop antenna.

Electronic device with shared antenna structures and balun

Electronic devices may include antenna structures. The antenna structures may form an antenna having first and second feeds at different locations. Transceiver circuitry for transmitting and receiving radio-frequency antenna signals may be mounted on one end of a printed circuit board. Transmission line structures may be used to convey signals between an opposing end of the printed circuit board and the transceiver circuitry. The printed circuit board may be coupled to an antenna feed structure formed from a flexible printed circuit using solder connections. The flexible printed circuit may have a bend and may be screwed to conductive electronic device housing structures using one or more screws at one or more respective antenna feed terminals. Electrical components such as an amplifier circuit and filter circuitry may be mounted on the flexible printed circuit.

Antenna having flexible feed structure with components

An electronic device may have multiple near-field communications antennas. Multiplexer circuitry may have a transceiver port that is coupled to a near-field communications transceiver, and multiple antenna ports coupled to respective near-field communications antennas. Non-near-field communications antennas may be used by non-near-field communications circuitry. The electronic device may have a housing with opposing first and second ends and a display. One of the near-field communications antennas and one of the non-near-field communications antenna may be formed from shared antenna structures at the first end. Another of the near-field communications antennas and another of the non-near-field communications antennas may be formed from shared antenna structures at the second end. An additional near field communications antenna may be overlapped by the display.

Electronic device with near-field antennas

Electronic devices may be provided that include radio-frequency transceiver circuitry and antennas. An antenna may be formed from an antenna resonating element and an antenna ground. The antenna resonating element may have a shorter portion that resonates at higher communications band frequencies and a longer portion that resonates at lower communications band frequencies. The resonating element may be formed from a peripheral conductive electronic device housing structure that is separated from the antenna ground by an opening. A parasitic monopole antenna resonating element or parasitic loop antenna resonating element may be located in the opening. Antenna tuning in the higher communications band may be implemented using an adjustable inductor in the parasitic element. Antenna tuning in the lower communications band may be implemented using an adjustable inductor that couples the antenna resonating element to the antenna ground.

Antenna with tunable high band parasitic element

Electronic devices may be provided that include radio-frequency transceiver circuitry and antennas. An antenna may be formed from an antenna resonating element and an antenna ground. The antenna resonating element may have a shorter portion that resonates at higher communications band frequencies and a longer portion that resonates at lower communications band frequencies. An extended portion of the antenna ground may form an inverted-F antenna resonating element portion of the antenna resonating element. The antenna resonating element may be formed from a peripheral conductive electronic device housing structure that is separated from the antenna ground by an opening. A first antenna feed may be coupled between the peripheral conductive electronic device housing structures and the antenna ground across the opening. A second antenna feed may be coupled to the inverted-F antenna resonating element portion of the antenna resonating element.

Electronic device antenna with multiple feeds for covering three communications bands

A wireless electronic device may contain at least one antenna tuning element for use in tuning the operating frequency range of the device. The antenna tuning element may include radio-frequency switches, continuously/semi-continuously adjustable components such as tunable resistors, inductors, and capacitors, and other load circuits that provide desired impedance characteristics. A test station may be used to measure the radio-frequency characteristics associated with the tuning element. The test station may provide adjustable temperature, power, and impedance control to help emulate a true application environment for the tuning element without having to place the tuning element within an actual device during testing. The test system may include at least one signal generator and a tester for measuring harmonic distortion values and may include at least two signal generators and a tester for measuring intermodulation distortion values. During testing, the antenna tuning element may be placed in a series or shunt configuration.

Methods for characterizing tunable radio-frequency elements

Electronic devices may include antenna structures. The antenna structures may form an antenna having first and second feeds at different locations. A first transceiver may be coupled to the first feed using a first circuit. A second transceiver may be coupled to the second feed using a second circuit. The first and second feeds may be isolated from each other using the first and second circuits. The second circuit may have a notch filter that isolates the second feed from the first feed at operating frequencies associated with the first transceiver. The first circuit may include an adjustable component such as an adjustable capacitor. The adjustable component may be placed in different states depending on the mode of operation of the second transceiver to ensure that the first feed is isolated from the second feed.

Electronic device with multiple antenna feeds and adjustable filter and matching circuitry

A test station may include a test host, testing devices, and a test enclosure. A device under test (DUT) having a near-field communications (NFC) antenna may be placed in the test enclosure during production testing. The testing devices may have test antennas that may convey NFC test signals to the DUT in the test enclosure. Distances between test antennas and the DUT may be monitored by measuring path loss from the test antennas throughout testing. The testing station may also include a test unit and an RF test antenna. The test unit may use the RF test antenna to convey RF test signals to the DUT in the test enclosure. The DUT is marked as a passing DUT if gathered test data is satisfactory for each testing device in the test station and distance measurements between the test antennas and the DUT throughout testing are consistent with calibration measurements.

Test systems with multiple NFC antennas

Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include antenna structures that are formed from an internal ground plane and a peripheral conductive housing member. The internal ground plane and peripheral conductive housing member may be separated by a gap. The internal ground plane may be formed from sheet metal structures having engagement features such as tabs bent upwards at an angle. Plastic structures may be insert molded over the engagement features. When the internal ground plane is mounted in the electronic device, the plastic structures may bridge the gap between the internal ground plane and the peripheral conductive housing member. An adjustable structure such as a washer with a selectable thickness may be mounted to the peripheral conductive housing member opposing conductive structures across the gap. The thickness ma be adjusted to adjust antenna performance.

Engagement features and adjustment structures for electronic devices with integral antennas

A portable electronic device is provided that has a hybrid antenna. The hybrid antenna may include a slot antenna structure and an inverted-F antenna structure. The slot antenna portion of the hybrid antenna may be used to provide antenna coverage in a first communications band and the inverted-F antenna portion of the hybrid antenna may be used to provide antenna coverage in a second communications band. The second communications band need not be harmonically related to the first communications band. The electronic device may be formed from two portions. One portion may contain conductive structures that define the shape of the antenna slot. One or more dielectric-filled gaps in the slot may be bridged using conductive structures on another portion of the electronic device. A conductive trim member may be inserted into an antenna slot to trim the resonant frequency of the slot antenna portion of the hybrid antenna.

Hybrid antennas for electronic devices

Growing community of inventors

San Jose, CA, United States of America

Dean F Darnell