Hutchinson Technology Corporation

Dean E Myers

Michael Wayne Davis

Mark A Miller

Nathaniel K Behning

Mark Steven Lewandowski

Ryan N Ruzicka

Peter Francis Ladwig

Douglas P Riemer

Clark T Olsen

Mark A Schmidt

Kenneth R Quast

Brent D Lien

Jeffry S Bennin

Lloyd C Goss

Gary E Gustafson

Todd W Boucher

Matthew S Lang

Michael T Hofflander

Joseph P Ortner

James H Dettmann

Sergey I Gritsenko

Zachary A Pokornowski

Yasushi Sakamoto

Bryan John Scheele

Galen D Houk

Daniel W Scheele

Erich W Bierbrauer

Jeffrey C Jones

Larry D Flessland

Gregory L Wheatley

David L Anderson

Beauregard J Gagnon

Diane L Rupp

Keith D Johnson

LeAnn Anderson

Randy J Johnson

Richard R Jenneke

SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.

Shape memory alloy actuators and methods thereof

A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.

Miniature pressure/force sensor with integrated leads

Shape memory alloy actuator

An identification device includes a first metal layer patterned into a planar coil winding and a second metal layer electrically connected to the first metal layer. The first metal layer is operable to provide a circuit inductance. The second metal layer is patterned to provide one or more overlapping areas with the first metal layer. The second metal layer is operable to provide a circuit capacitance. The identification device includes a dielectric layer separating the first metal layer and the second metal layer.

Component identification

Embodiments of the disclosure include a suspension assembly having a support member, a moving member movably coupled to the support member, and shape metal alloy wires coupled between the support and moving members by attachment structures. According to various embodiments, the attachment structures include at least one of: an adhesive disposed proximate to a side of the attachment structures and between the attachment structures.

Shape memory alloy wire attachment structures with adhesive for a suspension assembly

An LED package and method of manufacture. An embodiment of the LED package includes a metal base having a cavity, a flexible circuit on the base, a dielectric layer in the cavity, and an LED chip having a bottom side facing the base and electrically coupled to the flexible circuit. The LED chip is powered by current flowing through the flexible circuit, and heat generated by the LED chip is conducted to the base through the flexible circuit and the dielectric layer.

LED chip packaging with high performance thermal dissipation

Growing community of inventors

Stewart, MN, United States of America

Dean E Myers