Tsinghua University

De-hui Wan

Hsuen-Li Chen

Yen-Jen Chen

Shih-Yu Tseng

Sih-Wei Chang

Chao-Min Cheng

Szu-Ting Lin

Chung-Yao Yang

Yu-hsuan Chen

Ching-Wen Hwang

Shang-Yi Yi

A thermal radiation heat dissipation device for an electronic component includes a heat dissipation substrate including a heat dissipation surface having a heat dissipation surface emissivity; and an emissivity modulation layer disposed on the heat dissipation surface including an emissivity modulation layer surface having an emissivity modulation layer surface emissivity. The emissivity modulation layer surface emissivity is greater the heat dissipation surface emissivity.

Thermal radiation heat dissipation device for electronic component and preparation method thereof

A composite heat dissipation device includes an electromagnetic radiation dissipation pile including a polar dielectric material assembly including a plurality of polar dielectric material units. The polar dielectric material assembly is configured to interact with solar radiation. Surfaces of the polar dielectric material units each are configured to interact with the solar radiation to generate scattering of light. The polar dielectric material units each include an optical phonon configured to interact with thermal radiation to increase strength of the thermal radiation.

Composite heat dissipation device and preparation method and applications thereof

A surface enhanced Raman scattering device includes a substrate including a substrate surface having a substrate surface energy; a modulation layer formed on the substrate surface and including a modulation layer surface having a modulation layer surface energy; and a surface enhanced Raman scattering structure formed on the modulation layer surface. The modulation layer surface energy is less than the substrate surface energy. A method of manufacturing the surface enhanced Raman scattering device is also provided.

Surface enhanced Raman scattering device and method of manufacturing the same

The present invention provides a heavy metal detecting device and the fabricating method thereof. The heavy metal detecting device includes a substrate and a nano-metal-particle array. The fabricating method of the heavy metal detecting device includes following steps of: (S1) preparing a substrate, cleaning the substrate with a first liquid, and drying the substrate with a first gas; (S2) soaking the substrate in a first solution; (S3) after soaking the substrate for a first period of time, cleaning and drying the substrate with the first liquid and the first gas respectively; (S4) soaking the substrate in a pre-synthesized nano-metal-particle solution; and (S5) after soaking the substrate for a second period of time, cleaning and drying the substrate with a second liquid and the first gas respectively. Compared to the prior arts, the heavy metal detecting device of the present invention has the advantages of simplicity and rapidity.

Heavy metal detecting device and the fabricating method thereof

The present invention provides a fiber base sensor and the fabricating method thereof. More specifically, one of the main goals of the present invention is to solve the problem existing in the prior art of the failure of forming a plurality of nano-particles on the surface of the fiber base sensor evenly by utilizing self-assembly process with the nano-imprint process. Furthermore, the another goal of the present invention is to provide detail parameters required in the said nano-imprinting process for avoiding the efficiency drop caused by over-embedding the nano-particles into the fiber based sensor.

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Hsinchu, Taiwan

De-hui Wan