Sandia Corporation

Sandia National Laboratories

Dawn M Skala

Alfredo M Morales

Albert Alec Talin

Stewart K Griffiths

Linda Domeier

Leroy L Whinnery, Jr

Steven Howard Goods

Matthew W Losey

Patrick N Keifer

Craig C Henderson

Georg Aigeldinger

Chu-Yeu Peter Yang

Michael R Winter

Shawn M Allan

Disclosed is a method for making a polyurethane closed-cell foam material exhibiting a bulk density below 4 lbs/ftand high strength. The present embodiment uses the reaction product of a modified MDI and a sucrose/glycerine based polyether polyol resin wherein a small measured quantity of the polyol resin is 'pre-reacted' with a larger quantity of the isocyanate in a defined ratio such that when the necessary remaining quantity of the polyol resin is added to the 'pre-reacted' resin together with a tertiary amine catalyst and water as a blowing agent, the polymerization proceeds slowly enough to provide a stable foam body.

Method for providing a low density high strength polyurethane foam

The present invention is directed to the use of vitreous carbon as a substrate material for providing masks for X-ray lithography. The new substrate also enables a small thickness of the mask absorber used to pattern the resist, and this enables improved mask accuracy. An alternative embodiment comprised the use of vitreous carbon as a LIGA substrate wherein the VC wafer blank is etched in a reactive ion plasma after which an X-ray resist is bonded. This surface treatment provides a surface enabling good adhesion of the X-ray photoresist and subsequent nucleation and adhesion of the electrodeposited metal for LIGA mold-making while the VC substrate practically eliminates secondary radiation effects that lead to delamination of the X-ray resist form the substrate, the loss of isolated resist features, and the formation of a resist layer adjacent to the substrate that is insoluble in the developer.

Vitreous carbon mask substrate for X-ray lithography

The present invention describes a method for fabricating an x-ray mask tool which can achieve pattern features having lateral dimension of less than 1 micron. The process uses a thin photoresist and a standard lithographic mask to transfer an trace image pattern in the surface of a silicon wafer by exposing and developing the resist. The exposed portion of the silicon substrate is then anisotropically etched to provide an etched image of the trace image pattern consisting of a series of channels in the silicon having a high depth-to-width aspect ratio. These channels are then filled by depositing a metal such as gold to provide an inverse image of the trace image and thereby providing a robust x-ray mask tool.

X-ray mask and method for providing same

A method is provided for fabricating metallic microstructures, i.e., microcomponents of micron or submicron dimensions. A molding composition is prepared containing an optional binder and nanometer size (1 to 1000 nm in diameter) metallic particles. A mold, such as a lithographically patterned mold, preferably a LIGA or a negative photoresist mold, is filled with the molding composition and compressed. The resulting microstructures are then removed from the mold and the resulting metallic microstructures so provided are then sintered.

Fabrication of metallic microstructures by micromolding nanoparticles

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Fremont, CA, United States of America

Dawn M Skala